发明申请
- 专利标题： Integrated circuit housing
- 专利标题（中）： 集成电路外壳
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申请号： US10716196申请日： 2003-11-17
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公开(公告)号： US20050082652A1公开(公告)日： 2005-04-21
- 发明人: Debabani Choudhury , Ross Bowen , James Foschaar
- 申请人： Debabani Choudhury , Ross Bowen , James Foschaar
- 主分类号： H01L23/04
- IPC分类号： H01L23/04 ; H01L23/10 ; H01L23/552 ; H01L23/66 ; H01L23/02
摘要：
A housing for an integrated circuit, comprising a base for securing a substrate with an integrated circuit thereon, a top cover, and a body with a cavity for receiving the substrate and at least a portion of the top cover therein to form an enclosed housing therewith, the body including at least one connector extending from within the cavity to outside of the body and configured to contact the integrated circuit when the substrate is in the cavity.
公开/授权文献
- US07105924B2 Integrated circuit housing 公开/授权日：2006-09-12