发明申请
- 专利标题： Polishing pads including slurry and chemicals thereon and methods of fabricating the same
- 专利标题（中）： 包括浆料和化学品在内的抛光垫及其制造方法
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申请号： US10922778申请日： 2004-08-20
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公开(公告)号： US20050086869A1公开(公告)日： 2005-04-28
- 发明人: Moo-Yong Park , Jong-Won Lee , Sang-Rok Ha , Hong-Seong Son
- 申请人： Moo-Yong Park , Jong-Won Lee , Sang-Rok Ha , Hong-Seong Son
- 优先权： KR2003-60261 20030829
- 主分类号： H01L21/304
- IPC分类号： H01L21/304 ; B24B37/04 ; B24D11/00 ; B24D13/14
摘要：
Polishing pads are provided that include a substrate for a polishing pad and a plurality of spaced apart members on the substrate and protruding from the substrate. The plurality of members include at least one abrasive layer and at least one chemical additive layer. Related methods of fabricating polishing pads are also provided herein.
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