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    Flexible membrane for a polishing head and chemical mechanical polishing (CMP) apparatus having the same
    6.
    发明授权
    Flexible membrane for a polishing head and chemical mechanical polishing (CMP) apparatus having the same 有权
    用于抛光头的柔性膜和具有该柔性膜的化学机械抛光（CMP）装置

    公开(公告)号：US07166019B2

    公开(公告)日：2007-01-23

    申请号：US11044373

    申请日：2005-01-27

    申请人： Moo-Yong Park ,  Ja-Eung Koo ,  Sang-Cheol Han ,  Duk-Ho Hong

    发明人： Moo-Yong Park ,  Ja-Eung Koo ,  Sang-Cheol Han ,  Duk-Ho Hong

    IPC分类号： B24B49/00

    CPC分类号： B24B37/30 ,  Y10T279/11

    摘要： A flexible membrane for a polishing head and a chemical mechanical polishing (CMP) apparatus having the same are provided. The flexible membrane for a polishing head includes a compressing plate having a first face and a second face opposite to the first face. The first face of the compressing plate holds a substrate with a vacuum provided thereto and compresses the substrate on a polishing pad. The second face of the compressing plate is combined with a supporter of the polishing head. The second face and the supporter define a space to which the vacuum for holding the substrate and a first pneumatic pressure for compressing the substrate are applied. A dividing member combined with the supporter is formed on the second face. The dividing member divides the space into at least two regions. A pneumatic pressure-introducing portion is formed at the dividing member. A second pneumatic pressure is provided to the compressing plate through the pneumatic pressure-introducing portion.

    摘要翻译： 提供了一种用于抛光头的柔性膜和具有该柔性膜的化学机械抛光（CMP）装置。 用于抛光头的柔性膜包括具有第一面和与第一面相对的第二面的压缩板。 压缩板的第一面保持提供真空的基板，并将基板压在抛光垫上。 压缩板的第二面与抛光头的支撑件组合。 第二面和支撑件限定了用于保持基板的真空和用于压缩基板的第一气动压力的空间。 与支撑件组合的分隔构件形成在第二面上。 分隔构件将空间分成至少两个区域。 在分隔构件上形成气压导入部。 通过气动压力引入部分向压缩板提供第二气动压力。

    Flexible membrane for a polishing head and chemical mechanical polishing (CMP) apparatus having the same
    7.
    发明申请
    Flexible membrane for a polishing head and chemical mechanical polishing (CMP) apparatus having the same 有权
    用于抛光头的柔性膜和具有该柔性膜的化学机械抛光（CMP）装置

    公开(公告)号：US20050176354A1

    公开(公告)日：2005-08-11

    申请号：US11044373

    申请日：2005-01-27

    申请人： Moo-Yong Park ,  Ja-Eung Koo ,  Sang-Cheol Han ,  Duk-Ho Hong

    发明人： Moo-Yong Park ,  Ja-Eung Koo ,  Sang-Cheol Han ,  Duk-Ho Hong

    IPC分类号： B24B37/005 ,  B24B37/30 ,  H01L21/304 ,  B24B1/00

    CPC分类号： B24B37/30 ,  Y10T279/11

    摘要： A flexible membrane for a polishing head and a chemical mechanical polishing (CMP) apparatus having the same are provided. The flexible membrane for a polishing head includes a compressing plate having a first face and a second face opposite to the first face. The first face of the compressing plate holds a substrate with a vacuum provided thereto and compresses the substrate on a polishing pad. The second face of the compressing plate is combined with a supporter of the polishing head. The second face and the supporter define a space to which the vacuum for holding the substrate and a first pneumatic pressure for compressing the substrate are applied. A dividing member combined with the supporter is formed on the second face. The dividing member divides the space into at least two regions. A pneumatic pressure-introducing portion is formed at the dividing member. A second pneumatic pressure is provided to the compressing plate through the pneumatic pressure-introducing portion.

    摘要翻译： 提供了一种用于抛光头的柔性膜和具有该柔性膜的化学机械抛光（CMP）装置。 用于抛光头的柔性膜包括具有第一面和与第一面相对的第二面的压缩板。 压缩板的第一面保持提供真空的基板，并将基板压在抛光垫上。 压缩板的第二面与抛光头的支撑件组合。 第二面和支撑件限定了用于保持基板的真空和用于压缩基板的第一气动压力的空间。 与支撑件组合的分隔构件形成在第二面上。 分隔构件将空间分成至少两个区域。 在分隔构件上形成气压导入部。 通过气动压力引入部分向压缩板提供第二气动压力。

    Chemical mechanical polishing devices, pad conditioner assembly and polishing pad conditioning method thereof
    8.
    发明申请
    Chemical mechanical polishing devices, pad conditioner assembly and polishing pad conditioning method thereof 有权
    化学机械抛光装置，垫调节器组件及抛光垫调理方法

    公开(公告)号：US20070077871A1

    公开(公告)日：2007-04-05

    申请号：US11494613

    申请日：2006-07-28

    申请人： Moo-Yong Park ,  Tai-hyoung Kim ,  Choon-goang Kim ,  Dong-Il Kim

    发明人： Moo-Yong Park ,  Tai-hyoung Kim ,  Choon-goang Kim ,  Dong-Il Kim

    IPC分类号： B24B1/00 ,  B24B29/00 ,  B24B21/18

    CPC分类号： B24B53/017 ,  B24B1/04

    摘要： Chemical mechanical polishing (CMP) devices, a pad conditioner assembly and a polishing pad conditioning method thereof are provided. The CMP device planarizes a wafer by rotating a carrier, which has a wafer mounted on a lower surface of the carrier, over a rotating polishing table while supplying a slurry onto a polishing pad attached to an upper surface of the rotating polishing table. The CMP device may include a pad conditioner assembly that conditions the polishing pad by supplying a pad conditioning liquid onto the polishing pad and simultaneously transferring a megasonic vibration to the pad conditioning liquid to remove foreign substances from a surface of the polishing pad.

    摘要翻译： 提供化学机械抛光（CMP）装置，垫调节器组件和抛光垫调节方法。 CMP装置通过将具有安装在载体的下表面上的晶片的载体旋转在旋转的抛光台上，同时将浆料提供到附接到旋转的抛光台的上表面的抛光垫上来平坦化晶片。 CMP装置可以包括垫调节器组件，其通过将抛光垫调节液提供到抛光垫上来调节抛光垫，同时将兆声波振动传送到衬垫调节液以从抛光垫的表面去除异物。