Invention Application
- Patent Title: Multi-step phase shift mask and methods for fabrication thereof
- Patent Title (中): 多步相移掩模及其制造方法
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Application No.: US10693989Application Date: 2003-10-22
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Publication No.: US20050089764A1Publication Date: 2005-04-28
- Inventor: Ming Lu , Bin-Chang Chang , Li-Wei Kung
- Applicant: Ming Lu , Bin-Chang Chang , Li-Wei Kung
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Main IPC: G03C5/00
- IPC: G03C5/00 ; G03F9/00

Abstract:
A phase shift mask comprises a transparent substrate having a patterned opaque material layer formed thereupon to form a non-transmissive region of the transparent substrate and an adjoining transmissive region of the transparent substrate. A pit is formed within the transmissive region of the transparent substrate. The pit has a stepped sidewall such as to provide the phase shift mask with enhanced optical performance. The phase shift mask may be fabricated employing a self aligned method.
Public/Granted literature
- US07135257B2 Multi-step phase shift mask and methods for fabrication thereof Public/Granted day:2006-11-14
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