发明申请
- 专利标题: Diffusion system
- 专利标题(中): 扩散系统
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申请号: US10912059申请日: 2004-08-06
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公开(公告)号: US20050092244A1公开(公告)日: 2005-05-05
- 发明人: Jun-young Kim , Byoung-lyong Choi , Eun-kyung Lee
- 申请人: Jun-young Kim , Byoung-lyong Choi , Eun-kyung Lee
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 优先权: KR10-2003-0075814 20031029
- 主分类号: H01L21/223
- IPC分类号: H01L21/223 ; C23C8/06 ; C23C16/44 ; C23C16/448 ; C23C16/452 ; C23C16/54 ; C30B31/06 ; C30B31/10 ; C30B31/16 ; C30B35/00 ; H01L21/22 ; C23C16/00
摘要:
Provided is a diffusion system for forming a doping layer in a wafer. The diffusion system includes a bubbler for generating a doping gas; a premixer, which premixes the doping gas with reactive gases and preheats the gas mixture; a main chamber, in which the gas mixture reacts to the wafer; a buffer case, which externally isolates an exhaust port and a door for loading and unloading the wafer into and out or the main chamber; and a used gas exhaustion system, which exhausts a used gas after the reaction is finished in the main chamber.
公开/授权文献
- US07452423B2 Diffusion system 公开/授权日:2008-11-18
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