Invention Application
- Patent Title: Diffusion system
- Patent Title (中): 扩散系统
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Application No.: US10912059Application Date: 2004-08-06
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Publication No.: US20050092244A1Publication Date: 2005-05-05
- Inventor: Jun-young Kim , Byoung-lyong Choi , Eun-kyung Lee
- Applicant: Jun-young Kim , Byoung-lyong Choi , Eun-kyung Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Priority: KR10-2003-0075814 20031029
- Main IPC: H01L21/223
- IPC: H01L21/223 ; C23C8/06 ; C23C16/44 ; C23C16/448 ; C23C16/452 ; C23C16/54 ; C30B31/06 ; C30B31/10 ; C30B31/16 ; C30B35/00 ; H01L21/22 ; C23C16/00

Abstract:
Provided is a diffusion system for forming a doping layer in a wafer. The diffusion system includes a bubbler for generating a doping gas; a premixer, which premixes the doping gas with reactive gases and preheats the gas mixture; a main chamber, in which the gas mixture reacts to the wafer; a buffer case, which externally isolates an exhaust port and a door for loading and unloading the wafer into and out or the main chamber; and a used gas exhaustion system, which exhausts a used gas after the reaction is finished in the main chamber.
Public/Granted literature
- US07452423B2 Diffusion system Public/Granted day:2008-11-18
Information query
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