Invention Application
- Patent Title: Silicon carbide semiconductor device and its manufacturing method
- Patent Title (中): 碳化硅半导体器件及其制造方法
-
Application No.: US11003599Application Date: 2004-12-06
-
Publication No.: US20050093000A1Publication Date: 2005-05-05
- Inventor: Satoshi Tanimoto , Hideyo Okushi
- Applicant: Satoshi Tanimoto , Hideyo Okushi
- Applicant Address: JP Yokohama-shi JP Tokyo
- Assignee: NISSAN MOTOR CO., LTD.,NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Current Assignee: NISSAN MOTOR CO., LTD.,NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Current Assignee Address: JP Yokohama-shi JP Tokyo
- Priority: JP2001-377397 20011211; JP2002-122215 20020424
- Main IPC: H01L21/04
- IPC: H01L21/04 ; H01L29/12 ; H01L29/24 ; H01L29/739 ; H01L29/78 ; H01L29/94 ; H01L29/15 ; H01L21/00

Abstract:
In silicon carbide semiconductor device and manufacturing method therefor, a metal electrode which is another than a gate electrode and which is contacted with a singlecrystalline silicon carbide substrate is treated with a predetermined heat process at a temperature which is lower than a thermal oxidization temperature by which a gate insulating film is formed and is sufficient to carry out a contact annealing between the singlecrystalline silicon carbide substrate and a metal after a whole surrounding of the gate insulating film is enclosed with the singlecrystalline silicon carbide substrate, a field insulating film, and the gate electrode. The present invention is applicable to a MOS capacitor, an n channel planar power MOSFET, and an n channel planar power IGBT.
Public/Granted literature
- US07535025B2 Structure and manufacturing method for a silicon carbide semiconductor device Public/Granted day:2009-05-19
Information query
IPC分类: