发明申请
- 专利标题： Interconnection element for BGA housings and method for producing the same
- 专利标题（中）： BGA外壳的互连元件及其制造方法
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申请号： US10944684申请日： 2004-09-17
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公开(公告)号： US20050093148A1公开(公告)日： 2005-05-05
- 发明人: Andre Hanke , Stephan Dobritz
- 申请人： Andre Hanke , Stephan Dobritz
- 优先权： DE10343255.8 20030917
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/498 ; H05K3/00 ; H05K3/22 ; H05K3/34 ; H05K3/40 ; H01L21/44 ; H01L23/52
摘要：
An electronic component includes an interposer substrate and at least one semiconductor chip mounted on the interposer substrate. A plurality of electrical connections electrically couple a rewiring of the interposer substrate to contact regions of the at least one semiconductor chip. A plurality of connection elements are positioned for electrical contact-connection with a printed circuit board. The interconnection elements comprise hollow-cylindrical or rod-shaped elements that penetrate through and are fixedly connected to the interposer substrate.