发明申请
- 专利标题： Semiconductor device manufacturing system and method for manufacturing semiconductor devices
- 专利标题（中）： 半导体器件制造系统和半导体器件的制造方法
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申请号： US10935430申请日： 2004-09-08
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公开(公告)号： US20050095774A1公开(公告)日： 2005-05-05
- 发明人: Yukihiro Ushiku , Akira Ogawa , Hidenori Kakinuma , Shunji Shuto , Masahiro Abe , Tatsuo Akiyama , Shigeru Komatsu
- 申请人： Yukihiro Ushiku , Akira Ogawa , Hidenori Kakinuma , Shunji Shuto , Masahiro Abe , Tatsuo Akiyama , Shigeru Komatsu
- 优先权： JPP2003-355684 20030908; JPP2004-189971 20040628
- 主分类号： H01L21/3065
- IPC分类号： H01L21/3065 ; G05B19/418 ; H01L21/00 ; H01L21/02 ; H01L21/31 ; H01L21/316 ; H01L21/331
摘要：
The present invention provides a solution for interleaving data frames, in a semiconductor device manufacturing system in which the processing apparatus for conducting a process on any one of a semiconductor substrate and a thin film on a surface thereof; a self-diagnostic system for diagnosing a state of the processing apparatus; and a parameter fitting apparatus for maintaining a parameter of the self-diagnostic system when an inspection result of the semiconductor substrate having undergone the process has been determined to be correct, and for changing the parameter of the self-diagnostic system when the inspection result has been determined to be incorrect.
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