Invention Application
- Patent Title: Method of laminating copper foil onto a printed circuit board
- Patent Title (中): 将铜箔层压到印刷电路板上的方法
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Application No.: US11015273Application Date: 2004-12-16
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Publication No.: US20050098262A1Publication Date: 2005-05-12
- Inventor: Chia-Pin Lin , Chih-Peng Fan , Chang-Yun Hung , Sheng-Chou Lee
- Applicant: Chia-Pin Lin , Chih-Peng Fan , Chang-Yun Hung , Sheng-Chou Lee
- Main IPC: B32B15/04
- IPC: B32B15/04 ; B32B15/20 ; H05K3/38 ; B32B31/26

Abstract:
A method of laminating copper foil onto a substrate of a printed circuit board, wherein the substrate has an upper surface and a lower surface. Isolating material is coated onto both surfaces of the substrate to form isolating layers on the substrate. The isolating layers can be formed by roll coating, spray coating or screen printing. The thickness of the isolating layers can be controlled in accordance to the requirements of the circuits. Various types of metal foils can be laminated onto the isolating layers, followed by heating and pressurization processes to secure the metal foil onto the substrate.
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