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发明申请
US20050098609A1 Transient eutectic phase process for ceramic-metal bonding metallization and compositing 审中-公开
陶瓷 - 金属接合金属化和合成的瞬态共晶相工艺

Transient eutectic phase process for ceramic-metal bonding metallization and compositing
摘要：
A method for directly joining ceramics (10) and metals (12). The method involves forming a structure having a ceramic component (10), a more refractory metallic component and a less refractory metallic-material-based interlayer (14) disposed between the ceramic component (10) and the metallic component (12); adding a eutectic forming reactant to the metallic interlayer (14); and heating the structure to approximately a eutectic melting temperature of the reactant and the interlayer to form a metallic-material-based eutectic liquid that interacts with the metallic component to form a bond that directly joins the ceramic and metallic components to one another.
摘要（中）：

一种用于直接接合陶瓷（10）和金属（12）的方法。 该方法包括形成具有陶瓷部件（10），更难熔的金属部件和设置在陶瓷部件（10）和金属部件（12）之间的难熔金属材料类中间层（14）的结构。 向所述金属中间层（14）添加共晶形成反应物; 并将该结构加热至反应物和中间层的约共熔融温度以形成与金属组分相互作用以形成将陶瓷和金属组分直接连接在一起的键的基于金属材料的共晶液体。

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