发明申请
- 专利标题： Method of measuring thermal conductivity of honeycomb structure
- 专利标题（中）： 测量蜂窝结构导热率的方法
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申请号： US10505334申请日： 2003-03-14
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公开(公告)号： US20050105584A1公开(公告)日： 2005-05-19
- 发明人: Shuichi Ichikawa , Aiko Otsuka , Motomichi Itou , Takuma Makino
- 申请人： Shuichi Ichikawa , Aiko Otsuka , Motomichi Itou , Takuma Makino
- 申请人地址： JP Nagoya-city, Aichi-prefecture 467-8530
- 专利权人： NGK Insulators Ltd
- 当前专利权人： NGK Insulators Ltd
- 当前专利权人地址： JP Nagoya-city, Aichi-prefecture 467-8530
- 优先权： JP2002-077557 20020320
- 国际申请： PCT/JP03/03083 WO 20030314
- 主分类号： G01N25/18
- IPC分类号： G01N25/18
摘要：
The method for measurement of thermal conductivity of a honeycomb structure according to the present invention comprises the steps keeping the whole honeycomb structure in a steady temperature state with keeping two ends of the honeycomb structure at given different temperatures; and measuring a thermal conductivity of the honeycomb structure in the steady state. According to the present invention there is provided a method for measurement of thermal conductivity of a honeycomb structure, which can measure the thermal conductivity of a honeycomb structure in the shape of the honeycomb structure per se or in a predetermined block shape without preparing, for example, a test specimen of particular shape.