摘要:
There is disclosed a honeycomb structure 1 having a plurality of cells 4 partitioned by cell walls 2 to function as fluid passages, a predetermined cell 4 being plugged by a plugging material at one end face, a remaining cell 4 being plugged by the plugging material at the other end face, wherein a Young's modulus of the plugging material is lower than that of the cell wall 2. A strength of the plugging material is lower than that of the cell wall. A porosity of the plugging material is 97% or more of that of the cell wall. There is provided a honeycomb structure whose end face is not easily cracked and which is superior in durability.
摘要:
A bonding material for a honeycomb structure comprises inorganic particles in which D90/D10 is from 10 to 500, D10 is 100 μm or less and D90 is 4 μm or more, and the D10 and D90 are the values of 10% diameter and 90% diameter from a smaller particle diameter side, respectively, in volume-based integrated fractions of a particle diameter distribution measurement by a laser diffraction/scattering method.
摘要:
The method for measurement of thermal conductivity of a honeycomb structure according to the present invention comprises the steps keeping the whole honeycomb structure in a steady temperature state with keeping two ends of the honeycomb structure at given different temperatures; and measuring a thermal conductivity of the honeycomb structure in the steady state. According to the present invention there is provided a method for measurement of thermal conductivity of a honeycomb structure, which can measure the thermal conductivity of a honeycomb structure in the shape of the honeycomb structure per se or in a predetermined block shape without preparing, for example, a test specimen of particular shape.
摘要:
There is disclosed a plugged honeycomb structure having a PM collection capability which is not easily deteriorated even when used as a DPF in an exhaust system where broken metal pieces, sputter depositions and the like flow as loads. The plugged honeycomb structure includes plugging portions having depths of 2.0 mm or more and 12 mm or less, plug punch out strengths per unit length in a range of 3 MPa/mm or more and 50 MPa/mm or less, hydraulic diameters of 0.95 mm or more and less than 2.20 mm and porosities of 40% or more and 80% or less.
摘要:
A honeycomb structure includes honeycomb segments separated by porous partitions and having circulation holes through the honeycomb segments in an axial direction; a spacer positioned between neighboring honeycomb segments of the honeycomb segments; and a bonding layer located between honeycomb segments where the spacers are positioned and bonding the neighboring honeycomb segments. The spacer has Young's modulus in a range of 0.1 to 1.5 GPa. A ratio of area of the spacer to area of the bonding layer between the neighboring honeycomb segments is in a range of 0.2 to 30%.
摘要:
A method of manufacturing a monolithic honeycomb structure free from coarse pinhole defects, the method including: mixing ceramic powders, metal silicon whose surface is coated with an organic matter, a binder and water to obtain a mixture; kneading the mixture to form a plastic clay; pugging the plastic clay; extruding the pugged plastic clay from an extruder to form a green honeycomb body having a predetermined shape, the green honeycomb body lacking closed pores; drying the green honeycomb body; calcining the dried green honeycomb body; and firing the calcined green honeycomb body.
摘要:
The present invention provides a honeycomb structure in which a plurality of honeycomb segments each constituted by a cell structure having a plurality of cells divided from each other by partition walls and functioning as a passage for fluid and an outer wall provided at the circumference of the cell structure are bonded to each other at the outer walls by a bonding layer made of a bonding agent and converted into one piece, which honeycomb structure is characterized in that the bonding agent does not contain inorganic particles having diameters (μm) of at least 1.1 times the average surface roughness Ra (μm) of the outer wall, in an amount exceeding 30% by mass relative to the total of the bonding agent. In the honeycomb structure, the honeycomb segments as a constituent are strongly bonded to each other by a bonding agent and converted into one piece.
摘要:
There is disclosed a method of manufacturing a honeycomb structure in which defects or deformations during forming can be reduced, and yield can be improved. The method of manufacturing the honeycomb structure includes the steps of mixing and kneading a clay material including a ceramic material, a binder and water to obtain a clay; forming the resultant clay into a honeycomb shape to obtain a honeycomb formed body; and firing the resultant honeycomb formed body to obtain a honeycomb structure, a material further including a water absorption resin is used as the clay material, an inorganic binder only is used as the binder included in the clay material, an organic binder is not substantially used, and the honeycomb structure having a porosity of 40% or more is obtained.
摘要:
A method of manufacturing a honeycomb structure. (1) Water is added to silicon carbide particles and kneaded into a kneaded raw material. The silicon carbide particles have an average particle diameter of not less than 2 μm and not more than the honeycomb rib thickness×0.23 and a logarithmic standard deviation of the particle size distribution of not less than 0.15 and not more than 0.40 (step S11). (2) The kneaded raw material is extruded by extrusion into a honeycomb extruded body (step S12). (3) The extruded body is dried (step S13), calcined (step S14), and fired (step S15).
摘要:
A honeycomb structure, and a process for production thereof, formed by bonding into one piece via a bonding layer a plurality of honeycomb segments, the honeycomb segment having an outer wall, partition walls provided inside the outer wall, and a large number of through-holes divided by the partition walls and extending in the axial direction of the segment; the outer wall and bonding layer having a relation: d*[(κa/da)+(κc/dc)]≧κ≧d*[(κa/da)+(κc/dc)]×0.6 wherein κc (W/mK) and dc (cm) are respectively the thermal conductivity and thickness of the outer wall, κa (W/mK) and da (cm) are respectively the thermal conductivity and thickness of the bonding layer, and κ (W/mK) and d (cm) are respectively the thermal conductivity and thickness of a layer which is the sum of the outer wall and the bonding layer.