发明申请
US20050109453A1 Fabrication of LTCC T/R modules with multiple cavities and an integrated ceramic ring frame
有权
具有多个腔体和集成陶瓷环框架的LTCC T / R模块的制造
- 专利标题： Fabrication of LTCC T/R modules with multiple cavities and an integrated ceramic ring frame
- 专利标题（中）： 具有多个腔体和集成陶瓷环框架的LTCC T / R模块的制造
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申请号： US10718805申请日： 2003-11-24
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公开(公告)号： US20050109453A1公开(公告)日： 2005-05-26
- 发明人: Rena Jacobson , Tapan Gupta , John Fisher , Andrea Curbean
- 申请人： Rena Jacobson , Tapan Gupta , John Fisher , Andrea Curbean
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L23/538 ; H01Q1/32 ; H01Q9/04 ; H01Q21/00 ; B32B31/00
摘要：
A method of fabricating a transmit/receive (T/R) module utilizing low temperature co-fired ceramic (LTCC) material in place of high temperature co-fired ceramic (HTCC) material and utilizing a combination of multiple lamination steps which also include forming a ceramic frame, as opposed to a metal ring frame, in the process. Brazing metallization is also utilized to attach heat sinks and lids as well as pin connectors. The formation of the pin connectors is provided on the side surface of the T/R module with a side printing process.
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