A device comprises a first substrate, a second substrate and a compliant element. The compliant element is composed of a first, compliant material between the first substrate and the second substrate and has a side surface coated at least in part with a layer of a second material. The compliant element exhibits deformation consistent with the first substrate and a second side having been pressed together. In some embodiments, the second material is electrically conductive such that the compliant element provides a reliable electrical connection between the substrates. In other embodiments, the second material increases the hermeticity of the compliant element such that the compliant element provides a better hermetic seal between the substrates.