利索-全球专利检索

  1. 登录
  2. 注册
发明申请
US20050109745A1 Laser processing head 有权
激光加工头

  • 专利标题： Laser processing head
  • 专利标题（中）： 激光加工头
  • 申请号： US10800007
    申请日： 2004-03-15
  • 公开(公告)号： US20050109745A1
    公开(公告)日： 2005-05-26
  • 发明人: Michael Wessner
  • 申请人： Michael Wessner
  • 优先权： DE03005463 20030315; EP03005463.9 20030315
  • 主分类号： B23K26/12
  • IPC分类号： B23K26/12 ;  B23K26/14 ;  B23K26/20 ;  B23K26/38
Laser processing head
摘要：
A nozzle of a laser processing head for laser cutting and laser welding includes a laser beam outlet for directing a laser beam towards a processing location of a workpiece to be processed, a first gas supply channel for supplying a cutting gas towards the processing location of a workpiece to be processed when the laser processing head is used for laser cutting, and a second gas supply channel for supplying a welding gas towards the processing location of a workpiece to be processed; when the laser processing head is used for laser welding.
摘要（中）：

用于激光切割和激光焊接的激光加工头的喷嘴包括用于将激光束引向待处理工件的加工位置的激光束出口​​，用于向切割气体的加工位置供应切割气体的第一气体供应通道 激光加工头用于激光切割时待处理的工件;以及用于向被处理工件的加工位置供给焊接气体的第二气体供给通道; 当激光加工头用于激光焊接时。

公开/授权文献
信息查询
Global Dossier Espacenet
0/0