发明申请
- 专利标题: Bonding apparatus
- 专利标题(中): 接合装置
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申请号: US10973364申请日: 2004-10-25
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公开(公告)号: US20050109815A1公开(公告)日: 2005-05-26
- 发明人: Osamu Kakutani
- 申请人: Osamu Kakutani
- 专利权人: Kabushiki Kaisha Shinkawa
- 当前专利权人: Kabushiki Kaisha Shinkawa
- 优先权: JP2003-362711 20031023
- 主分类号: H01L21/60
- IPC分类号: H01L21/60 ; B23K20/00 ; B23Q15/00 ; H01L21/00
摘要:
A wire bonder including two link driving mechanisms and a head supporting stage provided with a bonding head via fluid pressure so that the bonding head is movable in the horizontal plane. Each link driving mechanism is formed by a motor, a driving arm, and a movable arm. The movable arm that extends from the driving arm of the first link driving mechanism is fastened to the bonding head, and the movable arm that extends from the driving arm of the second link driving mechanism is rotatably connected at its one end to the bonding head. A thrust aiming at the center of gravity of the bonding head is applied to the bonding head by the movable arms, thus moving the bonding head around.
公开/授权文献
- US07293686B2 Bonding apparatus 公开/授权日:2007-11-13
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