发明申请
- 专利标题： Method of manufacturing a semiconductor integrated circuit device which prevents foreign particles from being drawn into a semiconductor container containing semiconductor wafers
- 专利标题（中）： 制造半导体集成电路装置的方法，该装置防止外来颗粒被吸入含有半导体晶片的半导体容器中
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申请号： US10974819申请日： 2004-10-28
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公开(公告)号： US20050111937A1公开(公告)日： 2005-05-26
- 发明人: Yoshiaki Kobayashi , Shigeru Kobayashi , Kenji Tokunaga , Koji Kato , Teruo Minami
- 申请人： Yoshiaki Kobayashi , Shigeru Kobayashi , Kenji Tokunaga , Koji Kato , Teruo Minami
- 优先权： JP11-211724 19990727
- 主分类号： B65G1/00
- IPC分类号： B65G1/00 ; H01L21/673 ; H01L21/677
摘要：
When a conventional semiconductor container opening/closing apparatus opens a lid of a semiconductor container, foreign particles enter into the container from outside through a gap between the container and a wall surface of the container opening/closing apparatus and adhere to a wafer in the container. A method is provided to reduce the number of foreign particles adhering to the wafer by preventing foreign particles from entering into the container at the time of opening the container by the opening/closing apparatus. To achieve this, a velocity-differential pressure ratio obtained by dividing the maximum velocity at the time of opening the lid of the container in a vertical direction to an opening of the container, by the differential pressure between the inside pressure and the outside pressure of said semiconductor manufacturing apparatus, is set to be 0.06 ((m/s) Pa) or less.
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