-
1.发明申请Semiconductor container opening/closing apparatus and semiconductor device manufacturing method 有权半导体容器开闭装置及半导体装置的制造方法公开(公告)号：US20060182541A1
公开(公告)日：2006-08-17
申请号：US11391640
申请日：2006-03-29
IPC分类号： H01L21/677
CPC分类号： H01L21/67775 , H01L21/6735 , H01L21/67772
摘要： When a conventional semiconductor container opening/closing apparatus opens a lid of a semiconductor container, foreign particles enter into the container from outside through a gap between the container and a wall surface of the container opening/closing apparatus and adhere to a wafer in the container. An apparatus is provided to reduce the number of foreign particles adhering to the wafer by preventing foreign particles from entering into the container at the time of opening the container by the opening/closing apparatus. To achieve this, a velocity-differential pressure ratio obtained by dividing the maximum velocity at the time of opening the lid of the container in a vertical direction to an opening of the container, by the differential pressure between the inside pressure and the outside pressure of said semiconductor manufacturing apparatus, is set to be 0.06 ((m/s) Pa) or less.
摘要翻译： 当传统的半导体容器打开/关闭装置打开半导体容器的盖子时，异物通过容器和容器打开/关闭装置的壁表面之间的间隙从外部进入容器，并且粘附到容器中的晶片 。 提供了一种装置，用于通过打开/关闭装置打开容器时防止异物进入容器，从而减少附着在晶片上的异物的数量。 为了实现这一点，通过将容器的盖子在垂直方向上打开时的最大速度除以容器的开口之间的内压和外部压力之间的压差来获得的速度差压比 所述半导体制造装置设定为0.06（（m / s）Pa）以下。
-
2.发明授权Method of manufacturing a semiconductor integrated circuit device which prevents foreign particles from being drawn into a semiconductor container containing semiconductor wafers 有权制造半导体集成电路装置的方法，该装置防止外来颗粒被吸入含有半导体晶片的半导体容器中公开(公告)号：US07048493B2
公开(公告)日：2006-05-23
申请号：US10974819
申请日：2004-10-28
IPC分类号： H01L21/69
CPC分类号： H01L21/67775 , H01L21/6735 , H01L21/67772
摘要： When a conventional semiconductor container opening/closing apparatus opens a lid of a semiconductor container, foreign particles enter into the container from outside through a gap between the container and a wall surface of the container opening/closing apparatus and adhere to a wafer in the container. A method is provided to reduce the number of foreign particles adhering to the wafer by preventing foreign particles from entering into the container at the time of opening the container by the opening/closing apparatus. To achieve this, a velocity-differential pressure ratio obtained by dividing the maximum velocity at the time of opening the lid of the container in a vertical direction to an opening of the container, by the differential pressure between the inside pressure and the outside pressure of said semiconductor manufacturing apparatus, is set to be 0.06 ((m/s) Pa) or less.
摘要翻译： 当传统的半导体容器打开/关闭装置打开半导体容器的盖子时，异物通过容器和容器打开/关闭装置的壁表面之间的间隙从外部进入容器，并且粘附到容器中的晶片 。 提供了一种方法，用于通过打开/关闭装置打开容器时防止异物进入容器，从而减少附着在晶片上的异物的数量。 为了实现这一点，通过将容器的盖子在垂直方向上打开容器的最大速度与容器的开口之间的内压和外部压力之间的压差相除来获得的速度差压比 所述半导体制造装置设定为0.06（（m / s）Pa）以下。
-
3.发明申请SEMICONDUCTOR CONTAINER OPENING/CLOSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD 审中-公开半导体容器开关/闭合装置和半导体器件制造方法公开(公告)号：US20100086392A1
公开(公告)日：2010-04-08
申请号：US12569328
申请日：2009-09-29
IPC分类号： H01L21/677
CPC分类号： H01L21/67775 , H01L21/6735 , H01L21/67772
摘要： A method is provided of manufacturing semiconductor devices formed on a semiconductor wafer, including placing the wafer in a semiconductor container and conveying the container to a semiconductor manufacturing apparatus. An opening of the container is opposed to an opening of the apparatus such that an opener of the apparatus holds a lid of the opening the container. A key of the opener is inserted to a latch groove of the lid, and the key is rotated to contact a latch of the lid. The openings are connected such that a velocity differential pressure ratio obtained by dividing the maximum velocity when the opener holding the lid horizontally moves away from the opening of the container, by the differential pressure between the inside pressure and the outside pressure of the apparatus, is set to be 0.06 ((m/s)/Pa) or less, and then the wafer is processed.
摘要翻译： 提供一种制造形成在半导体晶片上的半导体器件的方法，包括将晶片放置在半导体容器中并将容器输送到半导体制造装置。 容器的开口与装置的开口相对，使得装置的开启器保持容器的开口盖。 开启器的钥匙被插入到盖的闩锁槽中，并且钥匙被旋转以接触盖的闩锁。 这些开口被连接成使得通过将保持盖的开启器水平地移动离开容器的开口的最大速度获得的速度差压比通过内部压力和设备的外部压力之间的压差来实现， 设定为0.06（（m / s）/ Pa）以下，然后处理晶片。
-
4.发明授权Semiconductor container opening/closing apparatus and semiconductor device manufacturing method 有权半导体容器开闭装置及半导体装置的制造方法公开(公告)号：US07314345B2
公开(公告)日：2008-01-01
申请号：US11391640
申请日：2006-03-29
IPC分类号： H01L21/677
CPC分类号： H01L21/67775 , H01L21/6735 , H01L21/67772
摘要： When a conventional semiconductor container opening/closing apparatus opens a lid of a semiconductor container, foreign particles enter into the container from outside through a gap between the container and a wall surface of the container opening/closing apparatus and adhere to a wafer in the container. An apparatus is provided to reduce the number of foreign particles adhering to the wafer by preventing foreign particles from entering into the container at the time of opening the container by the opening/closing apparatus. To achieve this, a velocity-differential pressure ratio obtained by dividing the maximum velocity at the time of opening the lid of the container in a vertical direction to an opening of the container, by the differential pressure between the inside pressure and the outside pressure of said semiconductor manufacturing apparatus, is set to be 0.06 ((m/s) Pa) or less.
摘要翻译： 当传统的半导体容器打开/关闭装置打开半导体容器的盖子时，异物通过容器和容器打开/关闭装置的壁表面之间的间隙从外部进入容器，并且粘附到容器中的晶片 。 提供了一种装置，用于通过打开/关闭装置打开容器时防止异物进入容器，从而减少附着在晶片上的异物的数量。 为了实现这一点，通过将容器的盖子在垂直方向上打开时的最大速度除以容器的开口之间的内压和外部压力之间的压差来获得的速度差压比 所述半导体制造装置设定为0.06（（m / s）Pa）以下。
-
5.发明申请Method of manufacturing a semiconductor integrated circuit device which prevents foreign particles from being drawn into a semiconductor container containing semiconductor wafers 有权制造半导体集成电路装置的方法，该装置防止外来颗粒被吸入含有半导体晶片的半导体容器中公开(公告)号：US20050111937A1
公开(公告)日：2005-05-26
申请号：US10974819
申请日：2004-10-28
IPC分类号： B65G1/00 , H01L21/673 , H01L21/677
CPC分类号： H01L21/67775 , H01L21/6735 , H01L21/67772
摘要： When a conventional semiconductor container opening/closing apparatus opens a lid of a semiconductor container, foreign particles enter into the container from outside through a gap between the container and a wall surface of the container opening/closing apparatus and adhere to a wafer in the container. A method is provided to reduce the number of foreign particles adhering to the wafer by preventing foreign particles from entering into the container at the time of opening the container by the opening/closing apparatus. To achieve this, a velocity-differential pressure ratio obtained by dividing the maximum velocity at the time of opening the lid of the container in a vertical direction to an opening of the container, by the differential pressure between the inside pressure and the outside pressure of said semiconductor manufacturing apparatus, is set to be 0.06 ((m/s) Pa) or less.
摘要翻译： 当传统的半导体容器打开/关闭装置打开半导体容器的盖子时，异物通过容器和容器打开/关闭装置的壁表面之间的间隙从外部进入容器，并且粘附到容器中的晶片 。 提供了一种方法，用于通过打开/关闭装置打开容器时防止异物进入容器，从而减少附着在晶片上的异物的数量。 为了实现这一点，通过将容器的盖子在垂直方向上打开容器的最大速度与容器的开口之间的内压和外部压力之间的压差相除来获得的速度差压比 所述半导体制造装置设定为0.06（（m / s）Pa）以下。
-
6.发明申请SEMICONDUCTOR CONTAINER OPENING/CLOSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD 审中-公开半导体容器开关/闭合装置和半导体器件制造方法公开(公告)号：US20080107517A1
公开(公告)日：2008-05-08
申请号：US11960804
申请日：2007-12-20
IPC分类号： B65H1/00
CPC分类号： H01L21/67775 , H01L21/6735 , H01L21/67772
摘要： A method is provided of manufacturing semiconductor devices formed on a semiconductor wafer, including placing the wafer in a semiconductor container and conveying the container to a semiconductor manufacturing apparatus. An opening of the container is opposed to an opening of the apparatus such that an opener of the apparatus holds a lid of the opening the container. A key of the opener is inserted to a latch groove of the lid, and the key is rotated to contact a latch of the lid. The openings are connected such that a velocity differential pressure ratio obtained by dividing the maximum velocity when the opener holding the lid horizontally moves away from the opening of the container, by the differential pressure between the inside pressure and the outside pressure of the apparatus, is set to be 0.06 ((m/s)/Pa) or less, and then the wafer is processed.
摘要翻译： 提供一种制造形成在半导体晶片上的半导体器件的方法，包括将晶片放置在半导体容器中并将容器输送到半导体制造装置。 容器的开口与装置的开口相对，使得装置的开启器保持容器的开口盖。 开启器的钥匙被插入到盖的闩锁槽中，并且钥匙被旋转以接触盖的闩锁。 这些开口被连接成使得通过将保持盖的开启器水平地移动离开容器的开口的最大速度获得的速度差压比通过内部压力和设备的外部压力之间的压差来实现， 设定为0.06（（m / s）/ Pa）以下，然后处理晶片。
-
公开(公告)号：US20060278612A1
公开(公告)日：2006-12-14
申请号：US11448032
申请日：2006-06-07
申请人： Kenji Tokunaga , Kazuhiko Kawai , Sakae Terakado
发明人： Kenji Tokunaga , Kazuhiko Kawai , Sakae Terakado
IPC分类号： C03C25/68 , B44C1/22 , C23F1/00 , H01L21/302
CPC分类号： H01L21/67167 , H01L21/02057 , H01L21/0206 , H01L21/02063 , H01L21/67017 , H01L21/6735
摘要： To provide a semiconductor integrated circuit device having improved reliability. An EFEM unit upstream of a plasma processing unit is equipped with a chemical filer for alkali removal. In the plasma processing unit, a semiconductor wafer is subjected to plasma processing with a gas containing fluorine. The resulting semiconductor wafer is put in a carrier via a transfer chamber, load lock chamber and EFEM chamber. During this operation, the concentration of amines in the EFEM chamber is adjusted to be lower than that of amines in a clean room outside the chamber by a chemical filter.
摘要翻译： 提供具有提高的可靠性的半导体集成电路器件。 在等离子体处理单元上游的EFEM单元配备有用于除碱的化学清洁器。 在等离子体处理单元中，用含氟气体对半导体晶片进行等离子体处理。 所得到的半导体晶片通过传送室，负载锁定室和EFEM室放入载体中。 在该操作中，通过化学过滤器将EFEM室中的胺浓度调节至低于室外洁净室的胺浓度。
-
8.发明授权Method of purging wafer receiving jig, wafer transfer device, and method of manufacturing semiconductor device 失效清洗晶片接收夹具的方法，晶片转移装置以及制造半导体器件的方法公开(公告)号：US06867153B2
公开(公告)日：2005-03-15
申请号：US10764563
申请日：2004-01-27
申请人： Kenji Tokunaga
发明人： Kenji Tokunaga
IPC分类号： H01L21/00 , H01L21/673 , H01L21/677 , H01L21/68 , B65B31/00 , F26B21/00
CPC分类号： H01L21/67017 , H01L21/67772 , H01L21/68
摘要： A FOUP having semiconductor wafers received therein is transferred to a loading port and then the door of the FOUP is fixed and removed by a FIMS door and then the semiconductor wafers are taken out of the shell of the FOUP and then a predetermined manufacturing processing is performed to the semiconductor wafers. After performing the manufacturing processing, the semiconductor wafers are returned into the shell and the FIMS door is returned to a closed position and the shell is retracted about 50 mm to 65 mm to form a gap between the FIMS door and the shell. Then, purge gas is introduced from a gas introduction pipe arranged above the loading port on the left and right sides in a slanting forward direction of the FIMS door into the shell to replace the atmosphere in the shell with the purge gas.
摘要翻译： 将其中容纳有半导体晶片的FOUP转移到装载端口，然后通过FIMS门固定和移除FOUP的门，然后将半导体晶片从FOUP的外壳中取出，然后执行预定的制造处理 到半导体晶片。 在执行制造处理之后，将半导体晶片返回到外壳中，并且FIMS门返回到关闭位置，并且壳缩回约50mm至65mm以在FIMS门和外壳之间形成间隙。 然后，将吹扫气体从布置在装载口上方的气体导入管引入到FIMS门的向前倾斜方向的左侧和右侧进入壳体中，以用吹扫气体代替壳体中的气氛。
-
9.发明授权Load port system for substrate processing system, and method of processing substrate 失效衬底处理系统的负载端口系统及衬底处理方法公开(公告)号：US06473996B1
公开(公告)日：2002-11-05
申请号：US09697174
申请日：2000-10-27
申请人： Kenji Tokunaga
发明人： Kenji Tokunaga
IPC分类号： F26B504
CPC分类号： H01L21/67259 , H01L21/67775 , H01L21/68 , Y10S414/137 , Y10S414/14
摘要： In a load port mechanism of a substrate treatment unit, protuberances are provided on a sealing surface formed along a door with which a wafer carrier is to dock, or on a sealing surface formed around the door of the wafer carrier. The wafer carrier door is faced with the load port door with the protuberances therebetween, thereby separating the sealing surface of the substrate treatment unit from the sealing surface of the wafer carrier by only a predetermined distance. Thus, there is formed a channel along which clean air flows from the inside of the substrate treatment unit to the outside thereof. The load port structure and the wafer carrier structure improve the reliability of opening/closing action of the wafer carrier and prevent entry of extraneous particles into the treatment unit with sufficient reliability, and enable high-yield production of integrated circuits.
摘要翻译： 在基板处理单元的负载端口机构中，在沿着与晶片载体对接的门形成的密封面上或在形成于晶片载体的门周围的密封面上设置突起。 晶片承载门面对负载端口门，其间具有突起，从而将基板处理单元的密封表面与晶片承载件的密封表面分开预定距离。 因此，形成有清洁空气从基板处理单元的内部流向其外部的通道。 负载端口结构和晶片载体结构提高了晶片载体的打开/关闭动作的可靠性，并且防止了外来颗粒以足够的可靠性进入处理单元，并且能够实现集成电路的高产量生产。
-
公开(公告)号：US4738736A
公开(公告)日：1988-04-19
申请号：US870745
申请日：1986-06-04
CPC分类号： B29D29/10 , B26D3/16 , B29C53/80 , B29C69/002 , B29D29/00
摘要： A method of and an apparatus for molding a belt for transmitting power, comprise mounting a cylindrical unvulcanized rubber sheet on a mandrel, selecting a necessary mandrel of a plurality of mandrels on which unvulcanized rubber sheets are mounted, moving the mandrel to a cord layer forming unit, winding a cord on the cylindrical unvulcanized rubber sheet mounted on the mandrel, moving the cord wound mandrel to a laminated body forming and cutting unit, winding an unvulcanized rubber sheet on the cord wound mandrel to form a laminated body, cutting the laminated body, moving the cut laminated body to an unvulcanized rubber sheet mounting unit, and taking out the belt.
摘要翻译： 一种用于模制用于传递动力的带的方法和装置，包括将圆柱形未硫化橡胶片安装在心轴上，选择其上安装有未硫化橡胶片的多个心轴的必需心轴，将心轴移动到形成 单元，将绳索缠绕在安装在心轴上的圆筒形未硫化橡胶片上，将帘线缠绕心轴移动到层叠体成形和切割单元，将未硫化橡胶片卷绕在缠绕心轴的芯线上以形成层叠体， 将切割的层压体移动到未硫化橡胶片安装单元，并取出带。
-
-
-
-
-
-
-
-
-
搜索结果
23 条记录 (耗时 0.029 秒)
