Invention Application
US20050112831A1 Method and apparatus for forming a semiconductor substrate with a layer structure of activated dopants 有权
用于形成具有活化掺杂剂的层结构的半导体衬底的方法和装置

  • Patent Title: Method and apparatus for forming a semiconductor substrate with a layer structure of activated dopants
  • Patent Title (中): 用于形成具有活化掺杂剂的层结构的半导体衬底的方法和装置
  • Application No.: US10966145
    Application Date: 2004-10-15
  • Publication No.: US20050112831A1
    Publication Date: 2005-05-26
  • Inventor: Radu Surdeanu
  • Applicant: Radu Surdeanu
  • Priority: EPEP03447259.7 20031017
  • Main IPC: H01L21/20
  • IPC: H01L21/20 H01L21/265 H01L21/268 H01L21/336 H01L29/78
Method and apparatus for forming a semiconductor substrate with a layer structure of activated dopants
Abstract:
Methods of forming semiconductor devices with a layered structure of thin and well defined layer of activated dopants, are disclosed. In a preferred method, a region in a semiconductor substrate is amorphized, after which the region is implanted with a first dopant at a first doping concentration. Then a solid phase epitaxy regrowth step is performed on a thin layer of desired thickness of the amorphized region, in order to activate the first dopant only in this thin layer. Subsequently, a second dopant is implanted in the remaining amorphous region at a second doping concentration. Subsequent annealing of the substrate activates the second dopant only in said remaining region, so a very abrupt transition between dopant characteristics of the thin layer with first dopant and the region with the second dopant is obtained.
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