Invention Application
US20050112831A1 Method and apparatus for forming a semiconductor substrate with a layer structure of activated dopants
有权
用于形成具有活化掺杂剂的层结构的半导体衬底的方法和装置
- Patent Title: Method and apparatus for forming a semiconductor substrate with a layer structure of activated dopants
- Patent Title (中): 用于形成具有活化掺杂剂的层结构的半导体衬底的方法和装置
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Application No.: US10966145Application Date: 2004-10-15
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Publication No.: US20050112831A1Publication Date: 2005-05-26
- Inventor: Radu Surdeanu
- Applicant: Radu Surdeanu
- Priority: EPEP03447259.7 20031017
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/265 ; H01L21/268 ; H01L21/336 ; H01L29/78

Abstract:
Methods of forming semiconductor devices with a layered structure of thin and well defined layer of activated dopants, are disclosed. In a preferred method, a region in a semiconductor substrate is amorphized, after which the region is implanted with a first dopant at a first doping concentration. Then a solid phase epitaxy regrowth step is performed on a thin layer of desired thickness of the amorphized region, in order to activate the first dopant only in this thin layer. Subsequently, a second dopant is implanted in the remaining amorphous region at a second doping concentration. Subsequent annealing of the substrate activates the second dopant only in said remaining region, so a very abrupt transition between dopant characteristics of the thin layer with first dopant and the region with the second dopant is obtained.
Public/Granted literature
- US07214592B2 Method and apparatus for forming a semiconductor substrate with a layer structure of activated dopants Public/Granted day:2007-05-08
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