发明申请
- 专利标题： Component packaging apparatus, systems, and methods
- 专利标题（中）： 组件包装设备，系统和方法
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申请号： US10750459申请日： 2003-12-31
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公开(公告)号： US20050116299A1公开(公告)日： 2005-06-02
- 发明人: Paul Koning , James Matayabas
- 申请人： Paul Koning , James Matayabas
- 主分类号： B05C1/00
- IPC分类号： B05C1/00 ; B05D3/12 ; H01L21/44 ; H05K1/03 ; H05K3/00 ; H05K3/10 ; H05K3/12 ; H05K3/46
摘要：
Dielectric materials comprising release agents are described. Also described are a process for improving the processability of dielectric materials during hot embossing, substrates prepared by hot embossing, and integrated-circuit packages comprising the improved substrate.
公开/授权文献
- US07365414B2 Component packaging apparatus, systems, and methods 公开/授权日：2008-04-29
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