发明申请
- 专利标题： Passivation of photonic integrated circuits (PICs)
- 专利标题（中）： 光子集成电路（PIC）的钝化
-
申请号： US11018162申请日： 2004-12-21
-
公开(公告)号： US20050117834A1公开(公告)日： 2005-06-02
- 发明人: Charles Joyner , Mark Missey , Radhakrishnan Nagarajan , Fred Kish
- 申请人： Charles Joyner , Mark Missey , Radhakrishnan Nagarajan , Fred Kish
- 申请人地址： US CA Sunnyvale
- 专利权人： Infinera Corporation
- 当前专利权人： Infinera Corporation
- 当前专利权人地址： US CA Sunnyvale
- 主分类号： G02B6/34
- IPC分类号： G02B6/34 ; G02B6/42 ; G02B6/12
摘要：
A photonic integrated circuit (PIC) comprises a plurality of integrated optically coupled components formed in a surface of the PIC and a passivating layer overlies at least a portion of the PIC surface. The overlying passivating layer comprises a material selected from the group consisting of BCB, ZnS and ZnSe. Also, when the circuits are PIC chips are die in the semiconductor wafer, a plurality of linear cleave streets are formed in a wafer passivation layer where a pattern of the cleave streets define separate PIC chips in the wafer for their subsequent singulation from the wafer.
公开/授权文献
- US07076126B2 Passivation of photonic integrated circuits (PICs) 公开/授权日：2006-07-11