发明申请
- 专利标题： Substrate treating apparatus
- 专利标题（中）： 底物处理装置
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申请号： US11037521申请日： 2005-01-18
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公开(公告)号： US20050124518A1公开(公告)日： 2005-06-09
- 发明人: Hiroaki Sugimoto , Seiichiro Okuda , Takuya Kuroda
- 申请人： Hiroaki Sugimoto , Seiichiro Okuda , Takuya Kuroda
- 专利权人： Dainippon Screen Mfg. Co., Ltd.
- 当前专利权人： Dainippon Screen Mfg. Co., Ltd.
- 优先权： JP2001-373586 20011207; JP2002-305200 20021021
- 主分类号： B08B5/00
- IPC分类号： B08B5/00 ; B08B3/02 ; B08B3/08 ; B08B7/00 ; H01L21/304 ; H01L21/306 ; C11D1/00
摘要：
A substrate treating apparatus includes a cleaning medium feed mechanism having a discharge nozzle for discharging warm water as a cleaning medium toward a substrate. The discharge nozzle is reciprocable between a position opposed to the center of rotation of the substrate held and rotated by a spin chuck and a position opposed to the edge of the substrate. The discharge nozzle is connected to a deionized water source through a solenoid valve and a heater. Deionized water fed from the deionized water source is heated warm and supplied to the substrate through the discharge nozzle.
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