发明申请
- 专利标题： Metal paste and film formation method using the same
- 专利标题（中）： 金属膏和成膜方法使用相同
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申请号： US11002407申请日： 2004-12-02
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公开(公告)号： US20050127332A1公开(公告)日： 2005-06-16
- 发明人: Hirofumi Nakagawa , Kenichiro Takaoka
- 申请人： Hirofumi Nakagawa , Kenichiro Takaoka
- 专利权人： TANAKA KIKINZOKU KOGYO K.K.
- 当前专利权人： TANAKA KIKINZOKU KOGYO K.K.
- 优先权： JPP2003-415487 20031212
- 主分类号： C23C18/02
- IPC分类号： C23C18/02 ; C23C20/00 ; H01B1/00 ; H01B1/20 ; H01B1/22 ; H01B13/00 ; H05K1/09
摘要：
A metal paste comprising a mixture consisting of: metal colloidal particles, which consist of particles consisting of one or more metals or metal oxides and a protective agent for protecting the particles; and organic metallic compounds. The metal paste preferably comprising a mixture consisting of: metal colloidal particles comprising, as a protective agent, a compound having an amino group, sulfanyl group, sulfide-type sulfanediyl group, hydroxy group, or ether-type oxy group; and organic metallic compounds such as mercaptan metallic compounds or sulfide metallic compounds of α-pinene, α-terpinenol, or isobornyl acetate, abietic acid metallic compounds, neodecanoic acid metallic compounds, 2-ethylhexanoic acid metallic compounds, naphthenic acid metallic compounds, or decanoic acid metallic compounds.
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