发明申请
- 专利标题： Semiconductor assembly with conductive rim and method of producing the same
- 专利标题（中）： 具有导电边缘的半导体组件及其制造方法
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申请号： US10737231申请日： 2003-12-15
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公开(公告)号： US20050127525A1公开(公告)日： 2005-06-16
- 发明人: Susan Alie , Bruce Wachtmann , Michael Judy , David Kneedler
- 申请人： Susan Alie , Bruce Wachtmann , Michael Judy , David Kneedler
- 主分类号： B81B7/00
- IPC分类号： B81B7/00 ; B81B7/02 ; H01L23/12
摘要：
An apparatus has first and second wafers, and a conductive rim between the first and second wafers. The conductive rim electrically and mechanically connects the first and second wafers. In addition, the conductive rim and second wafer at least in part seal an area on the surface of the first wafer.
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