发明申请
- 专利标题: Semiconductor device and method of manufacturing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US10750814申请日: 2004-01-05
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公开(公告)号: US20050128663A1公开(公告)日: 2005-06-16
- 发明人: Soichi Yamazaki , Hiroyuki Kanaya , Kazuhiro Tomioka , Koji Yamakawa
- 申请人: Soichi Yamazaki , Hiroyuki Kanaya , Kazuhiro Tomioka , Koji Yamakawa
- 优先权: JP2003-323330 20030916
- 主分类号: H01L27/105
- IPC分类号: H01L27/105 ; H01L21/02 ; H01L21/8246 ; H01L27/115 ; H02H9/00
摘要:
There is disclosed a semiconductor device comprising a capacitor comprising a lower electrode provided above a substrate, a capacitor insulating film selectively provided on the lower electrode, and an upper electrode selectively provided above the lower electrode so that the capacitor insulating film can be interposed between the upper and lower electrodes, an electrode protection film formed of oxide conductors containing at least one of metal elements such as Sr, Ti, Ru, Ir and Pt, and provided on the upper electrode, an interlayer insulating film provided on the electrode protection film, an upper layer interconnect wire for the lower electrode provided on the interlayer insulating film, and electrically connected to the lower electrode, and an upper layer interconnect wire for the upper electrode provided on the interlayer insulating film, and electrically connected to the upper electrode.
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