发明申请
- 专利标题: Method and apparatus for preparing thin resin film
- 专利标题(中): 制备薄树脂膜的方法和设备
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申请号: US10480347申请日: 2003-04-02
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公开(公告)号: US20050129860A1公开(公告)日: 2005-06-16
- 发明人: Noriyasu Echigo , Hiroshi Satani , Hideki Okumura , Hisaaki Tachihara
- 申请人: Noriyasu Echigo , Hiroshi Satani , Hideki Okumura , Hisaaki Tachihara
- 申请人地址: JP Osaka 571-8501
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JP Osaka 571-8501
- 优先权: JP2002-104417 20020405
- 国际申请: PCT/JP03/04239 WO 20030402
- 主分类号: B05D7/24
- IPC分类号: B05D7/24 ; C23C14/12 ; C23C14/24 ; H01G4/14 ; H01L51/52 ; B05D3/02 ; B05C5/00 ; B05D1/02 ; B67B7/00
摘要:
A liquid resin material stored in a resin material cup is sent to a supply tank under pressure through a primary side supply pipe by increasing the pressure in a pressure tank. The supply tank is provided with a piston that is displaced in accordance with the amount of the resin material in the supply tank, and the resin material is quantified by the stroke of the piston. The quantified resin material is sent to a heating member through an evaporation side supply pipe, is evaporated by heating, and condenses on a substrate. The resin material is quantified by filling the supply tank with the resin material temporarily, and only the filling resin material is sent to the heating member. Therefore, an evaporation amount becomes constant, and as a result, the thickness of a resin thin film is stabilized.
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