- 专利标题： Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
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申请号： US11050902申请日： 2005-02-03
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公开(公告)号： US20050130362A1公开(公告)日： 2005-06-16
- 发明人: Gregory Chrysler , Abhay Watwe , Sairam Agraharam , Kramadhati Ravi , C. Garner
- 申请人： Gregory Chrysler , Abhay Watwe , Sairam Agraharam , Kramadhati Ravi , C. Garner
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L21/20 ; H01L21/762 ; H01L23/373 ; H01L21/44
摘要：
Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.
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