公开(公告)号：US20070252253A1

公开(公告)日：2007-11-01

申请号：US11414273

申请日：2006-04-27

申请人： Gregory Chrysler ,  Rajashree Baskaran

发明人： Gregory Chrysler ,  Rajashree Baskaran

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L23/473 ,  H01L23/3121 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked die package includes a substrate (210, 310), a first die (220, 320) above the substrate, a spacer (230, 330) above the first die, a second die (240, 340) above the spacer, and a mold compound (250, 370) disposed around at least a portion of the first die, the spacer, and the second die. The spacer includes a heat transfer conduit (231, 331, 333, 351, 353) representing a path of lower overall thermal resistance than that offered by the mold compound itself. The heat transfer path created by the heat transfer conduit may result in better thermal performance, higher power dissipation rates, and/or lower operating temperatures for the stacked die package.

摘要翻译： 堆叠的管芯封装包括衬底（210,310），衬底上的第一管芯（220,320），第一管芯上方的间隔物（230,330），间隔物上方的第二管芯（240,340），以及 设置在第一模具，间隔件和第二模具的至少一部分周围的模具化合物（250,370）。 间隔件包括传热管道（231,331,333,351,353），其表示比由模具化合物本身提供的更低的整体热阻的路径。 由传热导管产生的传热路径可以导致堆叠管芯封装具有更好的热性能，更高的功耗率和/或较低的工作温度。

公开(公告)号：US20070090518A1

公开(公告)日：2007-04-26

申请号：US11255678

申请日：2005-10-20

申请人： Ioan Sauciuc ,  Gregory Chrysler

发明人： Ioan Sauciuc ,  Gregory Chrysler

IPC分类号： H01L23/34

CPC分类号： H01L23/38 ,  H01L35/16 ,  H01L2224/73253 ,  H01L2924/12044 ,  H01L2924/16152

摘要： An apparatus and associated method to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling apparatus comprising a heat spreader and one or more thermoelectric cooler(s) thermally coupled to the heat spreader provides cooling to one or more hot spot(s) of a microelectronic device, the one or more thermoelectric cooler(s) having a single heat exchanging element of a single material.

摘要翻译： 通常描述了向微电子器件提供局部冷却的装置和相关方法。 在这方面，根据一个示例性实施例，包括散热器和热耦合到散热器的一个或多个热电冷却器的冷却装置向微电子器件的一个或多个热点提供冷却，一个 或多个具有单个材料的单个热交换元件的热电冷却器。

公开(公告)号：US20060243315A1

公开(公告)日：2006-11-02

申请号：US11118814

申请日：2005-04-29

申请人： Gregory Chrysler ,  Shriram Ramanathan ,  Tian-An Chen

发明人： Gregory Chrysler ,  Shriram Ramanathan ,  Tian-An Chen

IPC分类号： H01L35/34

CPC分类号： H01L23/38 ,  H01L35/32 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： Embodiments include electronic assemblies and methods for forming electronic assemblies. Certain methods include forming a thermoelectric cooling (TEC) structure on a die, the TEC structure including a plurality of spaced apart TEC legs. A polymer is positioned between the spaced apart TEC legs of the TEC structure. The TEC structure may be positioned between the die and the heat spreader. In one method, a polymer in solid form is positioned on the TEC legs. The polymer in solid form is heated to a temperature sufficient so that a liquid polymer is formed, and the liquid polymer flows between the TEC legs. After being positioned between the TEC legs, the liquid polymer is solidified. Other embodiments are described and claimed.

摘要翻译： 实施例包括用于形成电子组件的电子组件和方法。 某些方法包括在模具上形成热电冷却（TEC）结构，TEC结构包括多个间隔开的TEC支腿。 聚合物位于TEC结构的间隔开的TEC腿之间。 TEC结构可以位于模具和散热器之间。 在一种方法中，固体形式的聚合物位于TEC腿上。 将固体形式的聚合物加热到足以形成液体聚合物的温度，并且液体聚合物在TEC腿之间流动。 在定位在TEC腿之间时，液体聚合物固化。 描述和要求保护其他实施例。

公开(公告)号：US20060226539A1

公开(公告)日：2006-10-12

申请号：US11101061

申请日：2005-04-07

申请人： Je-Young Chang ,  Ioan Sauciuc ,  Chuan Hu ,  Chia-Pin Chiu ,  Gregory Chrysler ,  Ravi Prasher

发明人： Je-Young Chang ,  Ioan Sauciuc ,  Chuan Hu ,  Chia-Pin Chiu ,  Gregory Chrysler ,  Ravi Prasher

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  F28F3/12 ,  F28F2260/02 ,  H01L2924/0002 ,  H01L2924/00

摘要： A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent and has a first section at a first location along the length extent and a second section at a second location along the length extent. The first section of the microchannel has a first aspect ratio and the second section is divided into at least two sub-channels. Each sub-channel has a respective second aspect ratio that is greater than the first aspect ratio.

摘要翻译： 微通道结构中形成有微通道。 微通道将输送冷却剂并靠近集成电路以将热量从集成电路传递到冷却剂。 微通道中的至少一个具有长度范围，并且具有沿着长度范围的第一位置处的第一部分和沿着长度范围的第二位置处的第二部分。 微通道的第一部分具有第一宽高比，第二部分被划分为至少两个子通道。 每个子通道具有大于第一宽高比的相应的第二宽高比。

公开(公告)号：US20060137732A1

公开(公告)日：2006-06-29

申请号：US11024357

申请日：2004-12-27

申请人： Mohammad Farahani ,  Gregory Chrysler ,  Kris Frutschy

发明人： Mohammad Farahani ,  Gregory Chrysler ,  Kris Frutschy

IPC分类号： H01L37/00 ,  H01L35/30 ,  H01L35/34

CPC分类号： H01L23/38 ,  H01L23/3675 ,  H01L23/473 ,  H01L25/16 ,  H01L35/02 ,  H01L35/32 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for fabricating a microelectronic assembly including a built-in TEC, a microelectronic assembly including a built-in TEC, and a system including the microelectronic assembly. The method includes providing a microelectronic device, and fabricating the TEC directly onto the microelectronic device such that there is no mounting material between the TEC and the microelectronic device.

摘要翻译： 一种用于制造包括内置TEC的微电子组件的方法，包括内置TEC的微电子组件以及包括微电子组件的系统。 该方法包括提供微电子器件，并将TEC直接制造到微电子器件上，使得在TEC和微电子器件之间不存在安装材料。

公开(公告)号：US20060097383A1

公开(公告)日：2006-05-11

申请号：US11298280

申请日：2005-12-09

申请人： Shriram Ramanathan ,  Sarah Kim ,  R. List ,  Gregory Chrysler

发明人： Shriram Ramanathan ,  Sarah Kim ,  R. List ,  Gregory Chrysler

IPC分类号： H01L23/34 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L35/32 ,  H01L23/38 ,  H01L23/50 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L27/16 ,  H01L2224/05001 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/4554

摘要： A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one embodiment, the thermoelectric elements are integrated between conductive interconnection elements on an active side of the die. In another embodiment, the thermoelectric elements are on a backside of the die and electrically connected to a carrier substrate on a front side of the die. In a further embodiment, the thermoelectric elements are formed on a secondary substrate and transferred to the die.

公开(公告)号：US20060033205A1

公开(公告)日：2006-02-16

申请号：US10917702

申请日：2004-08-13

申请人： Ioan Sauciuc ,  Gregory Chrysler

发明人： Ioan Sauciuc ,  Gregory Chrysler

IPC分类号： H01L23/34

CPC分类号： H01L23/42 ,  H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/15311 ,  H01L2224/0401

摘要： A liquid metal thermal interface for an integrated circuit die. The liquid metal thermal interface may be disposed between the die and another heat transfer element, such as a heat spreader or heat sink. The liquid metal thermal interface includes a liquid metal in fluid communication with a surface of the die, and liquid metal moving over the die surface transfers heat from the die to the heat transfer element. A surface of the heat transfer element may also be in fluid communication with the liquid metal. Other embodiments are described and claimed.

摘要翻译： 用于集成电路管芯的液态金属热接口。 液态金属热界面可以设置在模具和另一传热元件之间，例如散热器或散热器。 液体金属热界面包括与模具表面流体连通的液态金属，并且在模具表面上移动的液态金属将热量从模具传递到传热元件。 传热元件的表面也可以与液态金属流体连通。 描述和要求保护其他实施例。

公开(公告)号：US20060032608A1

公开(公告)日：2006-02-16

申请号：US11258785

申请日：2005-10-26

申请人： Gregory Chrysler ,  James Maveety

发明人： Gregory Chrysler ,  James Maveety

IPC分类号： F25B29/00

CPC分类号： H01L23/427 ,  F28D15/0233 ,  H01L2924/0002 ,  Y10S165/905 ,  Y10T29/49353 ,  H01L2924/00

摘要： A method and arrangement for dissipating heat from a localized area within a semiconductor die is presented. A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area. As such, thermal stress on the die is reduced, and total heat from the die is more readily dissipated.

公开(公告)号：US20050279109A1

公开(公告)日：2005-12-22

申请号：US10874131

申请日：2004-06-21

申请人： Gregory Chrysler ,  Gilroy Vandentop

发明人： Gregory Chrysler ,  Gilroy Vandentop

IPC分类号： F04B19/24 ,  F04B43/06 ,  F25B49/00 ,  H05K7/20

CPC分类号： H05K7/20272 ,  F04B19/24 ,  F04B43/06 ,  Y10T137/1624

摘要： Embodiments of the invention provide one or more valves in which an electroactive material acts to open or close the valves to increase efficiency of a pump, which may be a pump that uses an electroactive diaphragm to pump fluid. The valves and pump may pump fluid to cool a device in a system.

摘要翻译： 本发明的实施例提供一种或多种阀，其中电活性材料用于打开或关闭阀，以提高泵的效率，泵可以是使用电活性隔膜来泵送流体的泵。 阀和泵可以泵送流体以冷却系统中的装置。

公开(公告)号：US20050219816A1

公开(公告)日：2005-10-06

申请号：US10814051

申请日：2004-03-31

申请人： Gregory Chrysler ,  Ioan Sauciuc

发明人： Gregory Chrysler ,  Ioan Sauciuc

IPC分类号： H01L23/473 ,  H05K7/20

CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： Apparatus and methods in accordance with the present invention provide a system to create turbulence inside microchannels of a microchannel cooling subsystem to disrupt vapor locks therein.

摘要翻译： 根据本发明的装置和方法提供了一种在微通道冷却子系统的微通道内部产生紊流以破坏其中的蒸气锁的系统。