发明申请
- 专利标题: Electronic component mounting apparatus
- 专利标题(中): 电子元件安装装置
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申请号: US10974967申请日: 2004-10-28
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公开(公告)号: US20050132565A1公开(公告)日: 2005-06-23
- 发明人: Akira Aoki , Hideaki Fukushima , Kazuyoshi Oyama , Shuji Nushiyama , Takuya Imoto
- 申请人: Akira Aoki , Hideaki Fukushima , Kazuyoshi Oyama , Shuji Nushiyama , Takuya Imoto
- 申请人地址: JP Ora-gun
- 专利权人: Hitachi High-Tech Instruments Co., Ltd.
- 当前专利权人: Hitachi High-Tech Instruments Co., Ltd.
- 当前专利权人地址: JP Ora-gun
- 优先权: JP2003-371869 20031031
- 主分类号: H05K13/04
- IPC分类号: H05K13/04 ; B23Q15/00
摘要:
The invention is directed to quick adjustment of a positional relationship between two axes when an error occurs in the positional relationship between the axes when a beam is moved by two drive sources. According to movement of the beam for component picking and mounting operations, linear scale signals (outputs relating to positions of one drive axis and another drive axes) from linear scale reading heads are inputted to a Y2 driver and a Y1 driver respectively. Since each of the Y2 driver and the Y1 driver has a calculation means and a control means, when inputted with both the linear scale signals, each of the Y2 driver and the Y1 driver calculates a difference between positions of the drive axes of the beam by the calculation means, and controls a moving member of a linear motor by the control means based on the difference so as to increase thrust of one drive axis in a case where the one drive axis is in a more backward position than another drive axis and reduces the thrust of one drive axis in a case where the one drive axis in a more forward position than another drive axis.
公开/授权文献
- US07159305B2 Electronic component mounting apparatus 公开/授权日:2007-01-09
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