发明申请
- 专利标题： Management system and apparatus method therefor, and device manufacturing method
- 专利标题（中）： 管理系统及其装置方法及装置制造方法
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申请号： US10901106申请日： 2004-07-29
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公开(公告)号： US20050137837A1公开(公告)日： 2005-06-23
- 发明人: Satoru Oishi , Hideki Ina , Takehiko Suzuki , Koichi Sentoku , Takahiro Matsumoto
- 申请人： Satoru Oishi , Hideki Ina , Takehiko Suzuki , Koichi Sentoku , Takahiro Matsumoto
- 申请人地址： JP Tokyo
- 专利权人： CANON KABUSHIKI KAISHA
- 当前专利权人： CANON KABUSHIKI KAISHA
- 当前专利权人地址： JP Tokyo
- 优先权： JP129324/2002 20020430
- 主分类号： G03F9/00
- IPC分类号： G03F9/00 ; G03F7/20 ; G05B19/418 ; H01L21/027 ; G06F17/50
摘要：
A management apparatus which manages a parameter for an industrial device acquires AGA measurement results obtained by operating the industrial device with an operation job parameter value and non-operation job parameter value. An inspection apparatus acquires an “inspection result” obtained by inspecting the result of operating the industrial device in the operation job. A change in inspection result upon a change in parameter value is estimated on the basis of the AGA measurement result and inspection result. A variable which minimizes (extreme) both or at least one of the sensitivity (slope) of the inspection result upon a change in parameter value and variations (3σ) in inspection result between objects to be processed (e.g., wafers) is set as an optimal parameter.
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