Surface shape measuring apparatus, exposure apparatus, and device manufacturing method
    1.
    发明授权
    Surface shape measuring apparatus, exposure apparatus, and device manufacturing method 失效
    表面形状测量装置,曝光装置和装置制造方法

    公开(公告)号:US08564761B2

    公开(公告)日:2013-10-22

    申请号:US12393767

    申请日:2009-02-26

    Abstract: A surface shape measuring apparatus includes an illumination system and a light receiving system. The illumination system splits wide-band light from a light source into measurement light and reference light, illuminates the measurement light to obliquely enter a surface of the film, and illuminates the reference light to obliquely enter a reference mirror. The light receiving system combines the measurement light reflected by the surface of the film and the reference light reflected by the reference mirror with each other and introduces the combined light to a photoelectric conversion element. An incident angle of the measurement light upon the surface of the film and an incident angle of the reference light upon the reference mirror are each larger than the Brewster's angle. S-polarized light and p-polarized light included in the measurement light entering a surface of the substrate have equal intensity on the photoelectric conversion element.

    Abstract translation: 表面形状测量装置包括照明系统和光接收系统。 照明系统将来自光源的宽带光分解为测量光和参考光,照射测量光以倾斜地进入胶片的表面,并照亮参考光以倾斜地进入参考镜。 光接收系统将由膜的表面反射的测量光与由参考反射镜反射的参考光相互组合,并将组合的光引入光电转换元件。 在薄膜表面上的测量光的入射角和参考反射镜上的参考光的入射角均大于布鲁斯特角。 入射到衬底表面的测量光中包括的S偏振光和p偏振光在光电转换元件上具有相等的强度。

    Imprint apparatus and article manufacturing method
    2.
    发明授权
    Imprint apparatus and article manufacturing method 有权
    印刷装置及制品制造方法

    公开(公告)号:US08414279B2

    公开(公告)日:2013-04-09

    申请号:US12562052

    申请日:2009-09-17

    CPC classification number: G03F7/0002 B82Y10/00 B82Y40/00

    Abstract: An imprint apparatus molds resin dispensed on a shot region of a substrate with a mold and forms a pattern of resin on the shot region. The apparatus includes a mold stage configured to hold the mold, a substrate stage configured to hold the substrate, a drive mechanism configured to change a relative positional relationship between the mold stage and the substrate stage in an X-Y plane that defines a coordinate of the shot region and a Z-axis direction perpendicular to the X-Y plane, and a controller. The controller is configured to control the drive mechanism so that the mold and the shot region perform relative vibration, in the X-Y plane, with respect to a relative position where the mold and the shot region align, and a distance between the mold and the shot region decreases in the Z-axis direction in parallel with the vibration, and the resin is molded by the mold.

    Abstract translation: 压印装置用模具模制分配在基板的注射区域上的树脂,并在注射区域上形成树脂图案。 该装置包括:模具台,其被配置为保持模具;衬底台架,其被配置为保持基板;驱动机构,其构造成在限定射击坐标的XY平面内改变模具台架和基板台架之间的相对位置关系 区域和垂直于XY平面的Z轴方向,以及控制器。 控制器被配置为控制驱动机构,使得模具和射击区域在XY平面中相对于模具和射击区域对准的相对位置以及模具和射击之间的距离执行相对振动 Z轴方向的区域与振动平行地减小,树脂由模具成型。

    Process for producing a chip using a mold
    3.
    发明授权
    Process for producing a chip using a mold 有权
    使用模具制造芯片的工艺

    公开(公告)号:US07981304B2

    公开(公告)日:2011-07-19

    申请号:US12388179

    申请日:2009-02-18

    Abstract: A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate 2010 formed of a first material and an alignment mark 2102 formed of a second material different from the first material. The first material and the second material have transmissivities to light in a part of an ultraviolet wavelength range. The second material has a refractive index of not less than 1.7.

    Abstract translation: 该模具能够在将待固化的树脂材料设置在模具和待加工构件之间的状态下与要处理的构件高度准确地对准,并且由第一材料和对准构成的基板2010构成 标记2102由与第一材料不同的第二材料形成。 第一材料和第二材料在紫外线波长范围的一部分中具有透光性。 第二种材料的折射率不小于1.7。

    SURFACE SHAPE MEASUREMENT APPARATUS AND EXPOSURE APPARATUS
    4.
    发明申请
    SURFACE SHAPE MEASUREMENT APPARATUS AND EXPOSURE APPARATUS 失效
    表面形状测量装置和曝光装置

    公开(公告)号:US20090286172A1

    公开(公告)日:2009-11-19

    申请号:US12465567

    申请日:2009-05-13

    Abstract: A surface shape measurement apparatus is configured to measure a surface shape of an object to be measured, and includes a beam splitter configured to split white light from a light source into two light beams, a pair of prisms each configured to increase an incident angle of each light beam that has been split by the beam splitter and directed to the object or a reference surface, each prism having an antireflection part that is formed at a period of a wavelength of the white light or smaller and has a moth-eye shape, a superimposition unit configured to superimpose object light from the object with reference light from the reference surface and has passed the second prism, and to generate white interference light, and a Lyot filter configured to discretely separate the white interference light for each of a plurality of wavelengths.

    Abstract translation: 表面形状测量装置被配置为测量待测物体的表面形状,并且包括:分束器,被配置为将来自光源的白光分成两束光束;一对棱镜,每个棱镜被配置为增加入射角 已经被分束器分离并被引导到物体或参考表面的每个光束,每个棱镜具有在白色光的波长或更小的周期形成并具有蛾眼形状的抗反射部分, 叠加单元,被配置为用来自所述参考表面的参考光叠加来自所述物体的物体光并且已经通过所述第二棱镜,并且产生白色干涉光;以及Lyot滤波器,其被配置为离散地分离所述白色干涉光, 波长。

    IMPRINT APPARATUS, IMPRINT METHOD, AND MOLD FOR IMPRINT
    5.
    发明申请
    IMPRINT APPARATUS, IMPRINT METHOD, AND MOLD FOR IMPRINT 有权
    印刷装置,印刷方法和模具用于印刷

    公开(公告)号:US20090283938A1

    公开(公告)日:2009-11-19

    申请号:US12509996

    申请日:2009-07-27

    Abstract: An imprint apparatus for imprinting a mold pattern onto a substrate or a member on the substrate includes a light source for irradiating a surface of the mold disposed opposite to the substrate and a surface of the substrate with light; an optical system for guiding the light from the light source to the surface of the mold and the surface of the substrate and guiding reflected lights from these surfaces to a spectroscope; a spectroscope for dispersing the reflected lights guided by the optical system into a spectrum; and an analyzer for analyzing a distance between the surface of the mold and the surface of the substrate. The analyzer calculates the distance between the surface of the mold and the surface of the substrate by measuring a distance between the surface of the mold and a surface formed at a position away from the surface of the mold.

    Abstract translation: 用于将模具图案压印到基板或基板上的部件上的压印装置包括用于照射与基板相对设置的模具表面和基板的表面的光源; 用于将来自光源的光引导到模具的表面和基板的表面并将来自这些表面的反射光引导到分光器的光学系统; 用于将由光学系统引导的反射光分散到光谱中的分光镜; 以及分析器,用于分析模具表面与基板表面之间的距离。 分析器通过测量模具表面与形成在远离模具表面的位置的表面之间的距离来计算模具表面与基材表面之间的距离。

    ALIGNMENT METHOD, IMPRINT METHOD, ALIGNMENT APPARATUS, AND POSITION MEASUREMENT METHOD
    6.
    发明申请
    ALIGNMENT METHOD, IMPRINT METHOD, ALIGNMENT APPARATUS, AND POSITION MEASUREMENT METHOD 有权
    对准方法,印刷方法,对准装置和位置测量方法

    公开(公告)号:US20090108483A1

    公开(公告)日:2009-04-30

    申请号:US11719878

    申请日:2007-04-18

    Abstract: In an alignment method for effecting alignment between two plate-like objects, a first plate-like object provided with a first alignment mark and a second plate-like object provide with a second alignment mark are disposed opposite to each other. A first area and a second area are provided at mutually nonoverlapping positions in an image pickup area for being observed through an image pickup device. Images of the first and second alignment marks are picked up by the image pickup device from a direction substantially perpendicular to an in-plane direction of the first and second plate-like objects. Alignment control is effected by using first information about a deviation of the first alignment mark from a predetermined position in the first area and second information about a deviation of the second alignment mark from a predetermined position in the second area.

    Abstract translation: 在用于实现两个板状物体之间的对准的对准方法中,设置有第一对准标记的第一板状物体和提供有彼此相对设置的第二对准标记的第二板状物体。 第一区域和第二区域设置在图像拾取区域中的相互非重叠位置,以便通过图像拾取装置观察。 第一和第二对准标记的图像由图像拾取装置从基本上垂直于第一和第二板状物体的面内方向的方向拾取。 通过使用关于第一对准标记与第一区域中的预定位置的偏差的第一信息和关于第二对准标记与第二区域中的预定位置的偏差的第二信息来实现对准控制。

    Mold, imprint method, and process for producing chip
    7.
    发明授权
    Mold, imprint method, and process for producing chip 有权
    模具,压印方法和生产芯片的工艺

    公开(公告)号:US07510388B2

    公开(公告)日:2009-03-31

    申请号:US11468876

    申请日:2006-08-31

    Abstract: A mold capable of effecting alignment of the mold and the member to be processed with high accuracy even in such a state that a photocurable resin material is disposed between the mold and the member to be processed is constituted by a substrate 2010 formed of a first material and an alignment mark 2102 formed of a second material different from the first material. The first material and the second material have transmittivities to light in a part of an ultraviolet wavelength range of the ultraviolet light. The second material has a refractive index of not less than 1.7.

    Abstract translation: 即使在光固化树脂材料配置在模具和待加工构件之间的状态下,能够高精度地进行模具和被处理部件的对准的模具由基板2010构成,基板2010由第一材料 以及由不同于第一材料的第二材料形成的对准标记2102。 第一材料和第二材料在紫外线的紫外线波长范围的一部分中具有透光性。 第二种材料的折射率不小于1.7。

    Transfer characteristic calculation apparatus, transfer characteristic calculation method, and exposure apparatus
    8.
    发明授权
    Transfer characteristic calculation apparatus, transfer characteristic calculation method, and exposure apparatus 失效
    传输特性计算装置,传送特性计算方法和曝光装置

    公开(公告)号:US07443493B2

    公开(公告)日:2008-10-28

    申请号:US11688408

    申请日:2007-03-20

    CPC classification number: G01M11/0292

    Abstract: A transfer characteristic calculation apparatus for calculating a transfer characteristic of an imaging optical system includes a light source, a generation unit which generates a second signal by converting a first signal obtained by stretching an impulse signal on a space axis into a positive value using a light from the light source, a sensor which obtains an image that is output from the imaging optical system as an output signal when a light intensity distribution is inputted as the second signal, and a calculation unit which calculates the transfer characteristic of the imaging optical system by convolution of a third signal with the forth signal that is obtained by canceling a bias component of the output signal obtained by the sensor, the third being an impulse signal upon convolution with the first signal.

    Abstract translation: 用于计算成像光学系统的传送特性的传送特性计算装置包括光源,生成单元,其通过将使用空间轴将空间轴上的脉冲信号拉伸获得的第一信号转换成正值而产生第二信号 从所述光源接收作为所述第二信号输入光强度分布时的从所述摄像光学系统输出的图像作为输出信号的传感器,以及计算所述摄像光学系统的传送特性的计算单元, 第三信号与通过消除由传感器获得的输出信号的偏置分量获得的第四信号进行卷积,第三信号是与第一信号卷积的脉冲信号。

    Imprint Apparatus, Imprint Method, And Mold for Imprint
    9.
    发明申请
    Imprint Apparatus, Imprint Method, And Mold for Imprint 有权
    压印装置,压印方法和压印模具

    公开(公告)号:US20080099941A1

    公开(公告)日:2008-05-01

    申请号:US11719434

    申请日:2006-10-18

    Abstract: An imprint apparatus for imprinting a pattern provided to a mold onto a substrate or a member on the substrate includes a light source for irradiating a surface of the mold disposed opposite to the substrate and a surface of the substrate with light; an optical system for guiding the light from the light source to the surface of the mold and the surface of the substrate and guiding reflected lights from these surfaces to a spectroscope; a spectroscope for dispersing the reflected lights guided by the optical system into a spectrum; and an analyzer for analyzing a distance between the surface of the mold and the surface of the substrate. The analyzer calculates the distance between the surface of the mold and the surface of the substrate by measuring a distance between the surface of the mold and a surface formed at a position away from the surface of the mold.

    Abstract translation: 用于将提供给模具的图案压印到基板或基板上的部件上的印模装置包括用于照射与基板相对设置的模具的表面的光源和具有光的基板的表面; 用于将来自光源的光引导到模具的表面和基板的表面并将来自这些表面的反射光引导到分光器的光学系统; 用于将由光学系统引导的反射光分散到光谱中的分光镜; 以及分析器,用于分析模具表面与基板表面之间的距离。 分析器通过测量模具表面与形成在远离模具表面的位置的表面之间的距离来计算模具表面与基材表面之间的距离。

    Surface position measuring method, exposure apparatus, and device manufacturing method
    10.
    发明授权
    Surface position measuring method, exposure apparatus, and device manufacturing method 失效
    表面位置测量方法,曝光装置和装置制造方法

    公开(公告)号:US07313873B2

    公开(公告)日:2008-01-01

    申请号:US11489896

    申请日:2006-07-20

    CPC classification number: G03F9/7015 G03F9/7026

    Abstract: A surface position measuring method wherein measurement light is obliquely projected onto a substrate surface and on the basis of a position of the detected measurement light and a predetected offset, the position of the substrate surface with respect to a direction of an optical axis of the projection optical system is measured, memorizing a first position of a point on the substrate while using a reference mark provided on a substrate stage, measuring the position of the measurement light as a first measurement position; rotating the substrate by 180 deg. in a plane perpendicular to the optical axis; memorizing a second position of the measurement point on the rotated substrate with reference to the reference mark; measuring the position of the measurement light as a second measurement position; and detecting of the offset at the measurement point on the basis of the first and second measurement position.

    Abstract translation: 一种表面位置测量方法,其中测量光被倾斜地投射到基板表面上,并且基于检测到的测量光的位置和预先检测的偏移,基板表面相对于突起的光轴的方向的位置 测量光学系统,同时使用设置在基板台上的参考标记来记住基板上的点的第一位置,测量测量光的位置作为第一测量位置; 将基板旋转180度。 在垂直于光轴的平面中; 参照参考标记在旋转的基板上记录测量点的第二位置; 测量测量光的位置作为第二测量位置; 以及基于第一测量位置和第二测量位置检测测量点处的偏移。

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