发明申请
- 专利标题： Substrate polishing apparatus
- 专利标题（中）： 基材抛光装置
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申请号： US11013912申请日： 2004-12-17
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公开(公告)号： US20050142991A1公开(公告)日： 2005-06-30
- 发明人: Hidetaka Nakao , Yasumitsu Kawabata , Yoshifumi Katsumata , Naoki Ozawa , Tatsuya Sasaki , Atsushi Shigeta
- 申请人： Hidetaka Nakao , Yasumitsu Kawabata , Yoshifumi Katsumata , Naoki Ozawa , Tatsuya Sasaki , Atsushi Shigeta
- 优先权： JP422857/2003 20031219; JP209574/2004 20040716
- 主分类号： B24B51/00
- IPC分类号： B24B51/00 ; B24B49/03 ; B24B49/12 ; B24D7/12 ; H01L21/304 ; B24B7/00 ; B24B9/00 ; H01L21/76
摘要：
A substrate polishing apparatus is provided for preventing excessive polishing and insufficient polishing, and enabling a quantitative setting of an additional polishing time. The substrate polishing apparatus comprises a mechanism for polishing a substrate to be polished; a film thickness measuring device for measuring the thickness of a thin film deposited on the substrate; an interface for entering a target thickness for the polished thin film; a storage area for preserving past polishing results; and a processing unit for calculating a polishing time and a polishing rate. The substrate polishing apparatus builds an additional polishing database for storing data acquired from the result of additional polishing in the storage area.