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公开(公告)号:US20100151770A1
公开(公告)日:2010-06-17
申请号:US12700917
申请日:2010-02-05
申请人: Hidetaka NAKAO , Yasumitsu KAWABATA , Yoshifumi KATSUMATA , Naoki OZAWA , Tatsuya SASAKI , Atsushi SHIGETA
发明人: Hidetaka NAKAO , Yasumitsu KAWABATA , Yoshifumi KATSUMATA , Naoki OZAWA , Tatsuya SASAKI , Atsushi SHIGETA
IPC分类号: B24B51/00
CPC分类号: B24B37/013 , B24B49/03 , B24B49/12
摘要: A substrate polishing apparatus is provided for preventing excessive polishing and insufficient polishing, and enabling a quantitative setting of an additional polishing time. The substrate polishing apparatus comprises a mechanism for polishing a substrate to be polished; a film thickness measuring device for measuring the thickness of a thin film deposited on the substrate; an interface for entering a target thickness for the polished thin film; a storage area for preserving past polishing results; and a processing unit for calculating a polishing time and a polishing rate. The substrate polishing apparatus builds an additional polishing database for storing data acquired from the result of additional polishing in the storage area.
摘要翻译: 提供了用于防止过度抛光和研磨不足的基板抛光装置,并且能够定量设定额外的抛光时间。 基板抛光装置包括用于抛光待抛光的基板的机构; 用于测量沉积在基板上的薄膜的厚度的膜厚测量装置; 用于输入抛光薄膜的目标厚度的界面; 用于保存过去抛光结果的存储区域; 以及用于计算抛光时间和抛光速率的处理单元。 衬底抛光装置构建另外的抛光数据库,用于存储从存储区域中的附加抛光结果获取的数据。
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公开(公告)号:US08388409B2
公开(公告)日:2013-03-05
申请号:US12700917
申请日:2010-02-05
申请人: Hidetaka Nakao , Yasumitsu Kawabata , Yoshifumi Katsumata , Naoki Ozawa , Tatsuya Sasaki , Atsushi Shigeta
发明人: Hidetaka Nakao , Yasumitsu Kawabata , Yoshifumi Katsumata , Naoki Ozawa , Tatsuya Sasaki , Atsushi Shigeta
IPC分类号: B24B51/00
CPC分类号: B24B37/013 , B24B49/03 , B24B49/12
摘要: A substrate polishing apparatus is provided for preventing excessive polishing and insufficient polishing, and enabling a quantitative setting of an additional polishing time. The substrate polishing apparatus comprises a mechanism for polishing a substrate to be polished; a film thickness measuring device for measuring the thickness of a thin film deposited on the substrate; an interface for entering a target thickness for the polished thin film; a storage area for preserving past polishing results; and a processing unit for calculating a polishing time and a polishing rate. The substrate polishing apparatus builds an additional polishing database for storing data acquired from the result of additional polishing in the storage area.
摘要翻译: 提供了用于防止过度抛光和研磨不足的基板抛光装置,并且能够定量设定额外的抛光时间。 基板抛光装置包括用于抛光待抛光的基板的机构; 用于测量沉积在基板上的薄膜的厚度的膜厚测量装置; 用于输入抛光薄膜的目标厚度的界面; 用于保留过去抛光结果的存储区域; 以及用于计算抛光时间和抛光速率的处理单元。 衬底抛光装置构建另外的抛光数据库,用于存储从存储区域中的附加抛光结果获取的数据。
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公开(公告)号:US20050142991A1
公开(公告)日:2005-06-30
申请号:US11013912
申请日:2004-12-17
申请人: Hidetaka Nakao , Yasumitsu Kawabata , Yoshifumi Katsumata , Naoki Ozawa , Tatsuya Sasaki , Atsushi Shigeta
发明人: Hidetaka Nakao , Yasumitsu Kawabata , Yoshifumi Katsumata , Naoki Ozawa , Tatsuya Sasaki , Atsushi Shigeta
CPC分类号: B24B37/013 , B24B49/03 , B24B49/12
摘要: A substrate polishing apparatus is provided for preventing excessive polishing and insufficient polishing, and enabling a quantitative setting of an additional polishing time. The substrate polishing apparatus comprises a mechanism for polishing a substrate to be polished; a film thickness measuring device for measuring the thickness of a thin film deposited on the substrate; an interface for entering a target thickness for the polished thin film; a storage area for preserving past polishing results; and a processing unit for calculating a polishing time and a polishing rate. The substrate polishing apparatus builds an additional polishing database for storing data acquired from the result of additional polishing in the storage area.
摘要翻译: 提供了用于防止过度抛光和研磨不足的基板抛光装置,并且能够定量设定额外的抛光时间。 基板抛光装置包括用于抛光待抛光的基板的机构; 用于测量沉积在基板上的薄膜的厚度的膜厚测量装置; 用于输入抛光薄膜的目标厚度的界面; 用于保存过去抛光结果的存储区域; 以及用于计算抛光时间和抛光速率的处理单元。 基板抛光装置构建另外的抛光数据库,用于存储从存储区域中的附加抛光结果获取的数据。
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