发明申请
- 专利标题： Cooling devices and methods of using them
- 专利标题（中）： 冷却装置及其使用方法
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申请号： US10892303申请日： 2004-07-15
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公开(公告)号： US20050151554A1公开(公告)日： 2005-07-14
- 发明人: Alan Rae , Bawa Singh , William Varnell , Angelo Gulino , Mitch Holtzer , Joe Abys , Brian Lewis
- 申请人： Alan Rae , Bawa Singh , William Varnell , Angelo Gulino , Mitch Holtzer , Joe Abys , Brian Lewis
- 申请人地址： US RI Providence 02909
- 专利权人： Cookson Electronics, Inc.
- 当前专利权人： Cookson Electronics, Inc.
- 当前专利权人地址： US RI Providence 02909
- 主分类号： G01R31/02
- IPC分类号： G01R31/02 ; H01L21/60 ; H01L23/36
摘要：
A method and device for cooling an electronic component during its manufacture, repair, or rework is disclosed. In certain examples, the cooling device includes a cooling device body, and optionally a cooling medium, that can receive, absorb or extract heat from the electronic component and/or the surrounding environment.