公开(公告)号：US20060035413A1

公开(公告)日：2006-02-16

申请号：US10755944

申请日：2004-01-13

申请人： Alan Rae ,  Bawa Singh

发明人： Alan Rae ,  Bawa Singh

IPC分类号： H01L21/50

CPC分类号： H01L23/36 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method and device for cooling an electronic component during its manufacture, repair, or rework. There is a cooling unit in thermal communication with the electronic component which extracts heat therefrom.

摘要翻译： 一种用于在其制造，修理或返工期间冷却电子部件的方法和装置。 存在与电子部件热连通的冷却单元，其从其提取热量。

公开(公告)号：US20050151554A1

公开(公告)日：2005-07-14

申请号：US10892303

申请日：2004-07-15

申请人： Alan Rae ,  Bawa Singh ,  William Varnell ,  Angelo Gulino ,  Mitch Holtzer ,  Joe Abys ,  Brian Lewis

发明人： Alan Rae ,  Bawa Singh ,  William Varnell ,  Angelo Gulino ,  Mitch Holtzer ,  Joe Abys ,  Brian Lewis

IPC分类号： G01R31/02 ,  H01L21/60 ,  H01L23/36

CPC分类号： H01L23/36 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method and device for cooling an electronic component during its manufacture, repair, or rework is disclosed. In certain examples, the cooling device includes a cooling device body, and optionally a cooling medium, that can receive, absorb or extract heat from the electronic component and/or the surrounding environment.

摘要翻译： 公开了一种用于在其制造，修理或返工期间冷却电子部件的方法和装置。 在某些实例中，冷却装置包括可从电子部件和/或周围环境接收，吸收或提取热量的冷却装置主体和任选的冷却介质。

公开(公告)号：US06881074B1

公开(公告)日：2005-04-19

申请号：US10673652

申请日：2003-09-29

申请人： Allen James McLenaghan

发明人： Allen James McLenaghan

IPC分类号： H01L23/48 ,  H01R12/00 ,  H01R13/20 ,  H01R13/24 ,  H05K3/32

CPC分类号： H01R13/2435 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13011 ,  H01L2224/1308 ,  H01L2224/16227 ,  H01L2224/81193 ,  H01L2224/83899 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01R13/20 ,  H05K3/325 ,  H05K2201/0367 ,  H05K2201/10303 ,  H05K2201/10333

摘要： An assembly of the present invention has an integrated circuit device electrically and mechanically connected to the substrate. At least one electrically conductive connecting element is on one of the substrate and circuit device and at least one socket is on the other of the substrate and circuit device. The socket receives the at least one connecting element and comprises at least two resilient members. The resilient members are biased against the connecting element so that the circuit device and the substrate are held in electrical and mechanical connection by the biasing force of the resilient members against the connecting element.

摘要翻译： 本发明的组件具有电气和机械连接到基板的集成电路装置。 至少一个导电连接元件位于基板和电路装置中的一个上，并且至少一个插座位于基板和电路装置的另一个上。 插座容纳至少一个连接元件并且包括至少两个弹性构件。 弹性构件被偏置抵靠连接元件，使得电路装置和基板通过弹性构件的抵抗连接元件的偏置力保持在电气和机械连接中。

公开(公告)号：US20050056946A1

公开(公告)日：2005-03-17

申请号：US10663253

申请日：2003-09-16

申请人： Kenneth Gilleo

发明人： Kenneth Gilleo

IPC分类号： H01L21/60 ,  H05K3/30 ,  H01L29/40 ,  H01L21/48

CPC分类号： H01L24/81 ,  H01L24/17 ,  H01L24/75 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17505 ,  H01L2224/17517 ,  H01L2224/811 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/81862 ,  H01L2224/81906 ,  H01L2224/83101 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/305 ,  H05K2201/0129 ,  H05K2201/10734 ,  H05K2203/0126 ,  H05K2203/0545 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

摘要： An assembly of the present invention includes a substrate and an integrated circuit device adapted to be electrically and mechanically attached to the substrate. Electrically conductive connecting elements between the device and the substrate electrically connect the device and the substrate. At least one adhesive body is positioned between the integrated circuit device and the substrate to form a mechanical connection between the circuit device and the substrate. The at least one adhesive body comprises a non-thermosetting material which, when heated, releases said mechanical connection to allow removal of the circuit device from the substrate.

摘要翻译： 本发明的组件包括适于电性和机械地附接到基板的基板和集成电路装置。 器件和衬底之间的导电连接元件将器件和衬底电连接。 至少一个粘合体位于集成电路器件和衬底之间，以在电路器件和衬底之间形成机械连接。 所述至少一个粘合剂体包括非热固性材料，所述非热固性材料在被加热时释放所述机械连接以允许所述电路装置从所述基板移除。

公开(公告)号：US20050012191A1

公开(公告)日：2005-01-20

申请号：US10853696

申请日：2004-05-25

申请人： Kenneth Gilleo

发明人： Kenneth Gilleo

IPC分类号： H01L23/32 ,  H01L21/60 ,  H01L23/48 ,  H01L23/498 ,  H01L31/0203 ,  H01L23/495

CPC分类号： B81C3/002 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/81 ,  H01L31/0203 ,  H01L2224/05009 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/10135 ,  H01L2224/16105 ,  H01L2224/16227 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2224/81898 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19042 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

摘要： An assembly of the present invention has a substrate and an integrated circuit device adapted to be electrically and mechanically connected to the substrate. Electrical connection pads on the circuit device and on the substrate contact one another when the circuit device and the substrate are connected. At least one first projection on one of the device and on the substrate and at least two second projections on the other of the device and the substrate each have a respective axial length and are sized and shaped for a close friction fit along their axial lengths when the projections are interdigitated relative to one another. An integrated circuit device package of the present invention includes an integrated circuit device and an interconnect substrate for mounting the circuit device on an electronic circuit substrate. The interconnect substrate mates with the active side of the circuit device to form an enclosed space.

公开(公告)号：US20050151555A1

公开(公告)日：2005-07-14

申请号：US10944434

申请日：2004-09-17

申请人： Brian Lewis ,  Siman Slim ,  Angelo Gulino

发明人： Brian Lewis ,  Siman Slim ,  Angelo Gulino

IPC分类号： G01R31/02

CPC分类号： F25B9/145 ,  G01R31/2877 ,  H01L2224/16225 ,  H01L2924/15311

摘要： A method and device for cooling an electronic component during its manufacture, repair, or rework is disclosed. In certain examples, the cooling device includes a cooling device body optionally with one or more voids. In certain examples, a cooling medium that can receive, absorb or extract heat from the electronic component and/or the surrounding environment is disposed on or in the cooling device body. In some examples, a cooling device that includes a polymeric cooling device body, optionally with tape disposed on the polymeric cooling device body, is disclosed.

摘要翻译： 公开了一种用于在其制造，修理或返工期间冷却电子部件的方法和装置。 在某些实例中，冷却装置包括可选地具有一个或多个空隙的冷却装置主体。 在某些实例中，可以从电子部件和/或周围环境接收，吸收或提取热量的冷却介质设置在冷却装置本体上或冷却装置主体中。 在一些示例中，公开了一种冷却装置，其包括聚合物冷却装置主体，任选地带有设置在聚合物冷却装置主体上的带。

公开(公告)号：US06838372B2

公开(公告)日：2005-01-04

申请号：US10254703

申请日：2002-09-25

申请人： Kenneth B. Gilleo

发明人： Kenneth B. Gilleo

IPC分类号： H01L21/48 ,  H01L21/768 ,  H05K3/40 ,  H01L21/4763

CPC分类号： H05K3/4069 ,  H01L21/486 ,  H01L21/76898 ,  H05K2203/0191 ,  H05K2203/0759 ,  H05K2203/0769 ,  H05K2203/1461

摘要： A process for masking an electronic component substrate involving application of a temporary mask material to the substrate to form a removably adhered temporary mask over the surface. Exemplary mask materials include polymer films and aqueous hardenable liquid coatings. An electronic component substrate having a temporary mask for masking the substrate surface from interconnect fill material.

摘要翻译： 一种用于掩蔽电子部件基板的方法，包括将临时掩模材料施加到所述基板上，以在所述表面上形成可移除地粘附的临时掩模。 示例性掩模材料包括聚合物膜和水性可硬化液体涂料。 一种电子部件基板，具有用于从互连填充材料掩蔽基板表面的临时掩模。

公开(公告)号：US20040108588A1

公开(公告)日：2004-06-10

申请号：US10669901

申请日：2003-09-24

申请人： Cookson Electronics, Inc.

发明人： Kenneth B. Gilleo

IPC分类号： H01L023/12

CPC分类号： H01L24/97 ,  H01L23/10 ,  H01L23/3114 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/163 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package for protecting an integrated circuit device having an active side. The package includes a substrate for mounting the integrated circuit device and a plastic cap mounted on the substrate to form an enclosed space for the active side of the integrated circuit device. A thermal bond is formed between the substrate and the plastic cap to effectively seal the enclosed space so as to prevent the ingress of moisture or particulate.

摘要翻译： 一种用于保护具有有源侧的集成电路器件的封装。 封装包括用于安装集成电路器件的基板和安装在基板上的塑料盖，以形成用于集成电路器件的有源侧的封闭空间。 在基板和塑料盖之间形成热粘合，以有效地密封封闭空间，以防止湿气或微粒的进入。

公开(公告)号：US06936644B2

公开(公告)日：2005-08-30

申请号：US10271511

申请日：2002-10-16

申请人： Kenneth B. Gilleo

发明人： Kenneth B. Gilleo

IPC分类号： C09J201/00 ,  C08G59/18 ,  C08G59/68 ,  C08J3/24 ,  C09J11/00 ,  C09J163/00 ,  C09J163/02 ,  H05K3/30 ,  C08K3/04 ,  C08K9/10 ,  C08K63/00 ,  C08K63/02

CPC分类号： C08G59/188 ,  B33Y70/00 ,  C08G59/68 ,  C08J3/241 ,  C09J163/00 ,  H01L2224/83868 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/09701 ,  H05K3/305 ,  H05K2203/1163 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T428/2984 ,  Y10T428/2985 ,  Y10T428/2989

摘要： An uncured epoxy adhesive comprising a resin component, a hardener component, and a microencapsulated accelerator component. The microencapsulated accelerator component comprises an infrared absorber, an accelerator and a wall that covers substantially the entire surface of the accelerator. The epoxy adhesive is cured by exposing it to infrared energy. The infrared energy is absorbed by the infrared absorber which disintegrates the wall and allows the accelerator to come into contact with the other adhesive components and initiate the curing polymerization reaction.

摘要翻译： 一种未固化的环氧树脂粘合剂，其包含树脂组分，硬化剂组分和微胶囊化促进剂组分。 微胶囊加速剂组分包括红外线吸收剂，加速剂和覆盖加速器的整个表面的壁。 环氧树脂粘合剂通过将其暴露于红外能量而固化。 红外线能量被红外线吸收剂所吸收，其分解壁并允许促进剂与其它粘合剂组分接触并引发固化聚合反应。

公开(公告)号：US20050070131A1

公开(公告)日：2005-03-31

申请号：US10673652

申请日：2003-09-29

申请人： Allen McLenaghan

发明人： Allen McLenaghan

IPC分类号： H01L23/48 ,  H01R12/00 ,  H01R13/20 ,  H01R13/24 ,  H05K3/32

CPC分类号： H01R13/2435 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13011 ,  H01L2224/1308 ,  H01L2224/16227 ,  H01L2224/81193 ,  H01L2224/83899 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01R13/20 ,  H05K3/325 ,  H05K2201/0367 ,  H05K2201/10303 ,  H05K2201/10333

摘要： An assembly of the present invention has an integrated circuit device electrically and mechanically connected to the substrate. At least one electrically conductive connecting element is on one of the substrate and circuit device and at least one socket is on the other of the substrate and circuit device. The socket receives the at least one connecting element and comprises at least two resilient members. The resilient members are biased against the connecting element so that the circuit device and the substrate are held in electrical and mechanical connection by the biasing force of the resilient members against the connecting element.

摘要翻译： 本发明的组件具有电气和机械连接到基板的集成电路装置。 至少一个导电连接元件位于基板和电路装置中的一个上，并且至少一个插座位于基板和电路装置的另一个上。 插座容纳至少一个连接元件并且包括至少两个弹性构件。 弹性构件被偏置抵靠连接元件，使得电路装置和基板通过弹性构件的抵抗连接元件的偏置力保持在电气和机械连接中。