发明申请
- 专利标题: Transmission line with a transforming impedance and solder lands
- 专利标题(中): 具有变换阻抗和焊盘的传输线
-
申请号: US11021830申请日: 2004-12-24
-
公开(公告)号: US20050151597A1公开(公告)日: 2005-07-14
- 发明人: David Brunker , Victor Zaderej
- 申请人: David Brunker , Victor Zaderej
- 主分类号: H01P3/02
- IPC分类号: H01P3/02 ; H05K1/02 ; H05K3/10 ; H01P5/02
摘要:
A transmission line for high-frequency differential signals and having a transforming impedance is formed into a substrate. The transmission line is comprised of a slot, the opposing surfaces of which carry a conductive surface capable of carrying electrical signals. The conductive surface on the opposing surfaces is gradually receded along a length of the slot. An equivalent amount of metallization is applied on the substrate's surface and electrically continuous with conductive surfaces on the slot's opposing sidewalls. The metallization on the substrate's surface provide solder lands. Dielectric in the slot prevents solder wicking.
公开/授权文献
信息查询