发明申请
- 专利标题： Method for manufacturing connection construction
- 专利标题（中）： 制造连接结构的方法
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申请号： US11036135申请日： 2005-01-18
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公开(公告)号： US20050156324A1公开(公告)日： 2005-07-21
- 发明人: Yoshimi Nakase , Yoshitaugu Sakamoto , Hiroshi Ohki , Tomomasa Yoshida , Norio Kano
- 申请人： Yoshimi Nakase , Yoshitaugu Sakamoto , Hiroshi Ohki , Tomomasa Yoshida , Norio Kano
- 专利权人： DENSO CORPORATION & TOYOTA JIDOSHA KABUSHIKI KAISHA
- 当前专利权人： DENSO CORPORATION & TOYOTA JIDOSHA KABUSHIKI KAISHA
- 优先权： JP2004-11745 20040120
- 主分类号： B23K1/00
- IPC分类号： B23K1/00 ; H01L21/58 ; H01L21/60 ; H01L23/48 ; H01L23/52
摘要：
A method for manufacturing a connection construction having a first and a second connection members bonded therebetween with a solder layer includes the steps of: sandwiching the solder layer between the first and the second connection members; decompressing the solder layer down to a first pressure with maintaining a first temperature, which is lower than a solidus of the solder; heating the solder layer up to a second temperature with maintaining the first pressure, the second temperature being higher than a luquidus of the solder; compressing the solder layer up to a second pressure with maintaining the second temperature, the second pressure being higher than the first pressure; and hardening the solder with maintaining the second pressure.
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