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公开(公告)号:US20050233568A1
公开(公告)日:2005-10-20
申请号:US11108908
申请日:2005-04-19
IPC分类号: H01L21/60 , H01L21/44 , H01L23/482 , H01L23/488
CPC分类号: H01L24/83 , H01L24/29 , H01L24/32 , H01L2224/04026 , H01L2224/29 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/29298 , H01L2224/325 , H01L2224/83101 , H01L2224/83801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01016 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/19043 , H01L2924/00 , H01L2924/01028 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要: A method for manufacturing a semiconductor device having a solder layer includes the steps of: grinding a mounting surface of a semiconductor chip; etching the mounting surface of the chip; forming an electrode on the mounting surface of the chip; assembling the chip, the solder layer and a base in this order; and heating the chip, the solder layer and the base to be equal to or higher than a solidus temperature of the solder layer so that the solder layer is reflowed for soldering the chip on the base.
摘要翻译: 一种制造具有焊料层的半导体器件的方法包括以下步骤:研磨半导体芯片的安装表面; 蚀刻芯片的安装表面; 在芯片的安装表面上形成电极; 按顺序组装芯片,焊料层和基体; 并且将芯片,焊料层和基底加热至等于或高于焊料层的固相线温度,使得焊料层回流以将芯片焊接在基底上。
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公开(公告)号:US20050156324A1
公开(公告)日:2005-07-21
申请号:US11036135
申请日:2005-01-18
CPC分类号: H01L24/83 , H01L24/29 , H01L2224/29 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/29298 , H01L2224/83101 , H01L2224/8385 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/0105 , H01L2924/01051 , H01L2924/01068 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/1305 , H01L2924/13055 , H01L2924/15724 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要: A method for manufacturing a connection construction having a first and a second connection members bonded therebetween with a solder layer includes the steps of: sandwiching the solder layer between the first and the second connection members; decompressing the solder layer down to a first pressure with maintaining a first temperature, which is lower than a solidus of the solder; heating the solder layer up to a second temperature with maintaining the first pressure, the second temperature being higher than a luquidus of the solder; compressing the solder layer up to a second pressure with maintaining the second temperature, the second pressure being higher than the first pressure; and hardening the solder with maintaining the second pressure.
摘要翻译: 一种用于制造具有用焊料层接合在其间的第一和第二连接构件的连接结构的方法包括以下步骤:将焊料层夹在第一和第二连接构件之间; 将焊料层减压至第一压力,同时保持低于焊料固相线的第一温度; 在保持第一压力的同时将焊料层加热至第二温度,第二温度高于焊料的流动性; 在保持第二温度的同时将焊料层压缩至第二压力,第二压力高于第一压力; 并在保持第二压力的同时硬化焊料。
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公开(公告)号:US4667139A
公开(公告)日:1987-05-19
申请号:US792885
申请日:1985-10-30
CPC分类号: H02K41/031 , B23Q1/621 , G05B19/231 , G05B2219/41337
摘要: A first table is provided on a fixed base so that the first table can be moved in one of two directions which cross each other at right angles. A second table is provided on the first table so that the second table can be moved in the other direction. Linear motors for applying the driving force to the first and second tables to directly drive these tables are provided between the fixed base and first table and between the first and second tables.
摘要翻译: 第一工作台设置在固定的基座上,使得第一工作台能够沿直角交叉的两个方向之一移动。 在第一台上设置第二台,使得第二台可以沿另一个方向移动。 用于将驱动力施加到第一和第二台以直接驱动这些表的直线电机设置在固定基座和第一台之间以及第一和第二台之间。
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公开(公告)号:US5865453A
公开(公告)日:1999-02-02
申请号:US867722
申请日:1997-06-03
IPC分类号: B60G17/04 , B60G17/015 , B60G17/056 , F15B11/04 , F15B13/01 , F15B20/00 , B60G17/08
CPC分类号: B60G17/056 , B60G17/0152 , F15B13/01 , F15B20/00
摘要: When oil is discharged from an actuator 11i for lowering a vehicle height, an actuator pressure Pa is higher than a pump pressure Pp so that a differential pressure valve 41 slides its valving element 42 to the left by a pressure difference. A valving element seal portion 42b, abutted against a seat face 43a closing an opening of a lower return conduit 40b, moves from seat face 43a and open to lower return conduit 40b. As a result, the closure of the connected portion in the lower return conduit 40b is opened. Thus, the passage of a return conduit 40 is opened. Then, the oil from the actuator 11i is discharged via the return conduit 40 to the reserve tank 16 while receiving less flow resistance by avoiding a passage through any solenoid valve.
摘要翻译: 当油从用于降低车辆高度的致动器11i排出时,致动器压力Pa高于泵压力Pp,使得差压阀41将其阀元件42向左滑动压力差。 与封闭下返回导管40b的开口的座面43a抵接的阀元件密封部42b从座面43a移动并向下返回导管40b开口。 结果,打开下回路导管40b中连接部分的闭合。 因此,打开回流导管40的通道。 然后,通过避开通过任何电磁阀的通道,来自致动器11i的油通过返回导管40排出到储存罐16,同时接收较少的流动阻力。
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公开(公告)号:US4499774A
公开(公告)日:1985-02-19
申请号:US284340
申请日:1981-07-17
申请人: Masatoshi Tsuchiya , Ko Soeno , Tomomasa Yoshida
发明人: Masatoshi Tsuchiya , Ko Soeno , Tomomasa Yoshida
CPC分类号: G01L19/147
摘要: A semiconductor pressure transducer comprising a piezoresistive semiconductor diaphragm, a cylindrical stem made of a glass having a thermal expansion coefficient approximating that of the diaphragm and hermetically bonded by anodic bonding to the latter, and a cylindrical holder hermetically bonded by anodic bonding to the cylindrical stem is disclosed. The holder is made of a ferromagnetic alloy material containing Fe, Co and Ni and having a mean thermal expansion coefficient of 35.times.10.sup.-7 /.degree.C. or less within the temperature range between 30.degree. C. and 350.degree. C.
摘要翻译: 一种半导体压力传感器,包括压电半导体膜片,由玻璃制成的圆柱形阀杆,其热膨胀系数接近隔膜的热膨胀系数,并通过阳极接合而密封粘合到隔膜上;以及圆柱形保持器,通过阳极接合气密地接合到圆柱形杆 被披露。 夹持器由含Fe,Co和Ni的铁磁合金材料制成,在30℃至350℃的温度范围内的平均热膨胀系数为35×10 -7 /℃以下。
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公开(公告)号:US4342231A
公开(公告)日:1982-08-03
申请号:US217025
申请日:1980-12-16
申请人: Yoshimi Yamamoto , Yoshitaka Matsuoka , Syozo Kasai , Yukio Takahashi , Takeo Nagata , Akira Nagasu , Tomomasa Yoshida , Satoshi Shimada
发明人: Yoshimi Yamamoto , Yoshitaka Matsuoka , Syozo Kasai , Yukio Takahashi , Takeo Nagata , Akira Nagasu , Tomomasa Yoshida , Satoshi Shimada
CPC分类号: G01L19/147 , G01L13/025 , G01L19/0038 , G01L19/0645 , G01L19/142
摘要: A differential pressure transmitter has a pressure receiving portion and a sensor portion which are constituted from separate parts separably jointed with each other. The sensor portion includes a semiconductor sensor having one side formed with a resistance pattern and the other side which has a thick-walled peripheral portion and a thick-walled central portion. The semiconductor sensor is incorporated in the sensor portion as being supported at the thick-walled peripheral portion thereof. The pressure receiving portion includes seal diaphragms disposed on both sides of the pressure receiving portion and a central diaphragm disposed therein. The semiconductor sensor is arranged such that the side thereof carrying the resistance pattern faces the pressure receiving portion.
摘要翻译: 差压变送器具有压力接收部分和传感器部分,该压力接收部分和传感器部分由可分离地彼此连接的分开的部分构成。 传感器部分包括半导体传感器,其一侧形成有电阻图案,另一侧具有厚壁周边部分和厚壁中心部分。 半导体传感器被并入传感器部分中,被支撑在其厚壁周边部分。 受压部分包括设置在压力接收部分两侧的密封膜片和设置在其中的中心膜片。 半导体传感器被布置成使得其携带电阻图案的一侧面向压力接收部分。
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公开(公告)号:US07601625B2
公开(公告)日:2009-10-13
申请号:US11108908
申请日:2005-04-19
IPC分类号: H01L21/44
CPC分类号: H01L24/83 , H01L24/29 , H01L24/32 , H01L2224/04026 , H01L2224/29 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/29298 , H01L2224/325 , H01L2224/83101 , H01L2224/83801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01016 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/19043 , H01L2924/00 , H01L2924/01028 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要: A method for manufacturing a semiconductor device having a solder layer includes the steps of: grinding a mounting surface of a semiconductor chip; etching the mounting surface of the chip; forming an electrode on the mounting surface of the chip; assembling the chip, the solder layer and a base in this order; and heating the chip, the solder layer and the base to be equal to or higher than a solidus temperature of the solder layer so that the solder layer is reflowed for soldering the chip on the base.
摘要翻译: 一种制造具有焊料层的半导体器件的方法包括以下步骤:研磨半导体芯片的安装表面; 蚀刻芯片的安装表面; 在芯片的安装表面上形成电极; 按顺序组装芯片,焊料层和基体; 并且将芯片,焊料层和基底加热至等于或高于焊料层的固相线温度,使得焊料层回流以将芯片焊接在基底上。
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