发明申请
- 专利标题： Substrate edge grip apparatus
- 专利标题（中）： 基板边缘抓地装置
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申请号： US10758753申请日： 2004-01-15
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公开(公告)号： US20050158153A1公开(公告)日： 2005-07-21
- 发明人: Satish Sundar , Sanjeev Baluja
- 申请人： Satish Sundar , Sanjeev Baluja
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 主分类号： B65G1/00
- IPC分类号： B65G1/00 ; H01L21/687
摘要：
In one embodiment, the invention is a substrate edge gripper assembly for positioning a semiconductor substrate upon a transfer robot. In one embodiment, a modular assembly comprises spring loaded jaws that are mounted on either side of a robot end effector. The jaws are adapted to be actuated by a feature remote from the robot end effector to release the substrate for delivery.
公开/授权文献
- US07226269B2 Substrate edge grip apparatus 公开/授权日：2007-06-05
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