发明申请
- 专利标题: Method and apparatus for coating of substrates
- 专利标题(中): 用于涂布基材的方法和装置
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申请号: US10976348申请日: 2004-10-27
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公开(公告)号: US20050158449A1公开(公告)日: 2005-07-21
- 发明人: Ralph Chappa
- 申请人: Ralph Chappa
- 主分类号: B05B13/02
- IPC分类号: B05B13/02 ; B05B13/04 ; B05D3/00 ; B05C5/00
摘要:
The invention relates to methods and apparatuses that reduce problems encountered during coating of a device, such as a medical device having a cylindrical shape. In an embodiment, the invention includes an apparatus including a bi-directional rotation member. In an embodiment, the invention includes a method with a bi-directional indexing movement. In an embodiment, the invention includes a coating solution supply member having a major axis oriented parallel to a gap between rollers on a coating apparatus. In an embodiment, the invention includes a device retaining member. In an embodiment, the invention includes an air nozzle or an air knife. In an embodiment, the invention includes a method including removing a static charge from a small diameter medical device.
公开/授权文献
- US07125577B2 Method and apparatus for coating of substrates 公开/授权日:2006-10-24
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