发明申请
US20050158449A1 Method and apparatus for coating of substrates 有权
用于涂布基材的方法和装置

  • 专利标题: Method and apparatus for coating of substrates
  • 专利标题(中): 用于涂布基材的方法和装置
  • 申请号: US10976348
    申请日: 2004-10-27
  • 公开(公告)号: US20050158449A1
    公开(公告)日: 2005-07-21
  • 发明人: Ralph Chappa
  • 申请人: Ralph Chappa
  • 主分类号: B05B13/02
  • IPC分类号: B05B13/02 B05B13/04 B05D3/00 B05C5/00
Method and apparatus for coating of substrates
摘要:
The invention relates to methods and apparatuses that reduce problems encountered during coating of a device, such as a medical device having a cylindrical shape. In an embodiment, the invention includes an apparatus including a bi-directional rotation member. In an embodiment, the invention includes a method with a bi-directional indexing movement. In an embodiment, the invention includes a coating solution supply member having a major axis oriented parallel to a gap between rollers on a coating apparatus. In an embodiment, the invention includes a device retaining member. In an embodiment, the invention includes an air nozzle or an air knife. In an embodiment, the invention includes a method including removing a static charge from a small diameter medical device.
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