Invention Application
US20050158575A1 Method for forming thin film on synthetic resin and multilayer film
审中-公开
在合成树脂和多层膜上形成薄膜的方法
- Patent Title: Method for forming thin film on synthetic resin and multilayer film
- Patent Title (中): 在合成树脂和多层膜上形成薄膜的方法
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Application No.: US10495077Application Date: 2002-11-06
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Publication No.: US20050158575A1Publication Date: 2005-07-21
- Inventor: Kenji Hattori , Etsuo Ogino
- Applicant: Kenji Hattori , Etsuo Ogino
- Priority: JP2001-342018 20011107
- International Application: PCT/JP02/11580 WO 20021106
- Main IPC: G02B5/02
- IPC: G02B5/02 ; B32B15/08 ; C23C14/06 ; C23C14/20 ; G02B5/08 ; G02B5/20 ; G02F1/1333 ; G02F1/1335 ; G02F1/13357 ; C23C14/32

Abstract:
An object of the invention, in the formation of a thin film on a synthetic resin, is to improve adhesiveness between the synthetic resin and the thin film by a relatively simple method. In the invention, a protective metallic layer is formed on a synthetic resin, and one thin film of (1) a semi-transmitting metallic mirror, (2) a total reflection metallic mirror, or (3) a transparent conductive film is formed. The material of the protective metallic layer is preferably selected from the group of Ti, Zr, Nb, Si, In, and Sn, and for sake of ensuring adhesiveness between the synthetic resin and the thin film, the film thickness of the protective metal layer is preferably 1 nm or more. Also, when the film thickness of the protective metallic layer is large, transmittance of the whole of the laminated film is lowered due to light absorption by the protective metallic layer, and hence, the film thickness of the protective metallic layer is preferably not more than 5 nm.
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