发明申请
- 专利标题: Adhesive compound and method for forming photoresist pattern using the same
- 专利标题(中): 粘合剂和使用其形成光刻胶图案的方法
-
申请号: US11033154申请日: 2005-01-12
-
公开(公告)号: US20050158651A1公开(公告)日: 2005-07-21
- 发明人: Jin-A Ryu , Boo-Deuk Kim , Kyoung-Mi Kim , Young-Ho Kim
- 申请人: Jin-A Ryu , Boo-Deuk Kim , Kyoung-Mi Kim , Young-Ho Kim
- 优先权: KR2004-3012 20040115
- 主分类号: G03C1/492
- IPC分类号: G03C1/492 ; G03F7/075
摘要:
An adhesive compound for use during the formation of a photoresist film represented by the following chemical formula, wherein R represents a photoacid generator is disclosed.
公开/授权文献
信息查询