发明申请
- 专利标题： HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 混合集成电路装置及其制造方法
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申请号： US10905259申请日： 2004-12-22
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公开(公告)号： US20050161251A1公开(公告)日： 2005-07-28
- 发明人: Haruhiko Mori , Masaru Kanakubo , Hideyuki Sakamoto
- 申请人： Haruhiko Mori , Masaru Kanakubo , Hideyuki Sakamoto
- 申请人地址： JP Osaka JP Gunma
- 专利权人： SANYO ELECTRIC CO., LTD.,KANTO SANYO SEMICONDUCTORS CO., LTD.
- 当前专利权人： SANYO ELECTRIC CO., LTD.,KANTO SANYO SEMICONDUCTORS CO., LTD.
- 当前专利权人地址： JP Osaka JP Gunma
- 优先权： JP2003-428409 20031224
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/58 ; H01L21/60 ; H01L23/13 ; H01L23/28 ; H01L23/433 ; H01L23/495 ; H01L23/498 ; H01L23/50 ; H05K1/05 ; H05K3/28 ; H05K3/38 ; H05K3/40 ; H05K7/06
摘要：
To provide a hybrid integrated circuit device in which the rear surface of a circuit board is exposed to the outside and a method of manufacturing the same. Here, leads are fixed to the surface of the circuit board along one side thereof. A method of manufacturing a hybrid integrated circuit device includes the steps of forming an electric circuit which includes a conductive pattern formed on a surface of a circuit board and a circuit element electrically connected to the conductive pattern, fixing a lead to a pad formed of the conductive pattern, housing the circuit board in a cavity of molds, and fixedly supporting the lead by clamping the lead between the molds, and performing sealing by filling inside of the cavity with sealing resin with the rear surface of the circuit board made in contact with an inside bottom surface of the molds.
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