Invention Application
- Patent Title: Wiring circuit board and production method thereof
- Patent Title (中): 接线电路板及其制作方法
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Application No.: US11020350Application Date: 2004-12-22
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Publication No.: US20050161775A1Publication Date: 2005-07-28
- Inventor: Yasuhito Funada , Tetsuya Ohsawa , Yasuhito Ohwaki
- Applicant: Yasuhito Funada , Tetsuya Ohsawa , Yasuhito Ohwaki
- Applicant Address: JP Ibaraki-shi
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Ibaraki-shi
- Priority: JP425508/2003 20031222
- Main IPC: G11B5/60
- IPC: G11B5/60 ; G11B5/31 ; G11B5/39 ; G11B21/21 ; G11B33/12 ; H01L23/58 ; H05K1/02 ; H05K1/11 ; H05K3/00 ; H05K3/28 ; H05K3/46

Abstract:
In the vicinity of the exposed part 1A of the multiply formed plural wiring conductors 1, of the thicknesses of the insulating cover layer 2 made of a polyimide layer, the thickness (T1) of a part located at about the middle point between the adjacent wiring conductors 1 is made smaller than the thickness (T2) of a part located on wiring conductor 1. Preferably, the difference in the thicknesses of a part located at about the middle point between the adjacent wiring conductors of the insulating cover layer 2 and that of a part located on wiring conductor is made to fall within the range of 1-5 μm. As a result, the insulating cover layer does not peel off easily.
Public/Granted literature
- US07084493B2 Wiring circuit board and production method thereof Public/Granted day:2006-08-01
Information query
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