公开(公告)号：US20060269730A1

公开(公告)日：2006-11-30

申请号：US11439307

申请日：2006-05-24

Applicant: Jun Ishii ,  Yasuhito Funada ,  Yasunari Ooyabu

Inventor： Jun Ishii ,  Yasuhito Funada ,  Yasunari Ooyabu

IPC: B32B3/00 ,  B32B17/00 ,  B05D5/12

CPC classification number: H05K1/0259 ,  H05K1/056 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/0317 ,  H05K2203/0315 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A wired circuit board that can remove static electricity not only from an insulating base layer and an insulating cover layer but also from a terminal portion, to effectively prevent an electronic component mounted from being damaged by static electricity and also prevent stripping of a semi-conductive layer. In a suspension board with circuit including an insulating base layer formed on a metal supporting board, a conductive pattern formed on the insulating base layer, and an insulating cover layer, formed on the insulating cover layer, to cover the conductive pattern and form an opening, semi-conductive layer is formed in succession on an upper surface of the insulating base layer covered with the insulating cover layer, on a lateral side surface and an upper surface of the conductive pattern, and on a lateral side surface of the insulating base layer adjacent to the metal supporting board.

公开(公告)号：US20060023435A1

公开(公告)日：2006-02-02

申请号：US11187865

申请日：2005-07-25

Applicant: Yasunari Ooyabu ,  Yasuhito Funada ,  Hitoki Kanagawa ,  Tetsuya Ohsawa

Inventor： Yasunari Ooyabu ,  Yasuhito Funada ,  Hitoki Kanagawa ,  Tetsuya Ohsawa

IPC: H05K7/06 ,  G11B5/49

CPC classification number: H05K1/181 ,  H05K1/056 ,  H05K3/28 ,  H05K2201/09972 ,  Y02P70/611

Abstract: A wired circuit board that can prevent inconsistency in characteristic impedance to allow effective transmission of electrical signals from a magnetic head to a control board portion. A wired circuit board 1 is constructed so that a suspension board portion 2 for supporting the magnetic head 15 and a control board portion 3 for controlling the magnetic head 15 are formed to be continuous and integral with each other. To be more specific, a first conductor layer 10 connected to the magnetic head 15 in the suspension board portion 2 and a second conductor layer 11 connected to a preamplifier IC 12 in the control board portion 3 are formed from the same material and formed on a common insulating base layer 9 simultaneously. Further, a common insulating cover layer 13 to cover the first conductor layer 10 and the second conductor layer 11 is formed on the common insulating base layer 9. This arrangement of the wired circuit board 1 can eliminate the need of providing the connection point for connecting the first conductor layer 10 of the suspension board portion 2 and the second conductor layer 11 of the control board portion 3 at the boundary therebetween.

Abstract translation: 一种可以防止特性阻抗不一致的有线电路板，以允许有效地将电信号从磁头传输到控制板部分。 布线电路板1被构造成使得用于支撑磁头15的悬挂板部分2和用于控制磁头15的控制板部分3彼此连续并且一体地形成。 更具体地说，连接到悬挂板部分2中的磁头15的第一导体层10和连接到控制板部分3中的前置放大器IC 12的第二导体层11由相同的材料形成并形成在 公共绝缘基层9同时。 此外，在公共绝缘基底层9上形成覆盖第一导体层10和第二导体层11的公共绝缘覆盖层13。 布线电路板1的这种布置可以消除在其间的边界处提供用于连接悬挂板部分2的第一导体层10和控制板部分3的第二导体层11的连接点的需要。

公开(公告)号：US20050161775A1

公开(公告)日：2005-07-28

申请号：US11020350

申请日：2004-12-22

Applicant: Yasuhito Funada ,  Tetsuya Ohsawa ,  Yasuhito Ohwaki

Inventor： Yasuhito Funada ,  Tetsuya Ohsawa ,  Yasuhito Ohwaki

IPC: G11B5/60 ,  G11B5/31 ,  G11B5/39 ,  G11B21/21 ,  G11B33/12 ,  H01L23/58 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/46

CPC classification number: G11B33/122 ,  G11B5/3103 ,  G11B5/3967 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/28 ,  H05K2201/0154 ,  H05K2201/0191

Abstract: In the vicinity of the exposed part 1A of the multiply formed plural wiring conductors 1, of the thicknesses of the insulating cover layer 2 made of a polyimide layer, the thickness (T1) of a part located at about the middle point between the adjacent wiring conductors 1 is made smaller than the thickness (T2) of a part located on wiring conductor 1. Preferably, the difference in the thicknesses of a part located at about the middle point between the adjacent wiring conductors of the insulating cover layer 2 and that of a part located on wiring conductor is made to fall within the range of 1-5 μm. As a result, the insulating cover layer does not peel off easily.

Abstract translation: 在由聚酰亚胺层制成的绝缘覆盖层2的厚度的多重形成的多个布线导体1的露出部分1A的附近，位于中间点之间的部分的厚度（T 1） 使相邻布线导体1小于位于布线导体1上的部分的厚度（T 2）。 优选地，将位于绝缘覆盖层2的相邻布线导体和位于布线导体的部分的相邻布线导体之间的中点附近的部分的厚度差设为在1-5μm的范围内。 结果，绝缘覆盖层不容易剥离。

公开(公告)号：US08134080B2

公开(公告)日：2012-03-13

申请号：US11477935

申请日：2006-06-30

Applicant: Jun Ishii ,  Yasuhito Ohwaki ,  Yasuhito Funada

Inventor： Jun Ishii ,  Yasuhito Ohwaki ,  Yasuhito Funada

IPC: H05K1/09

CPC classification number: H05K3/38 ,  H05K1/056 ,  H05K3/06 ,  H05K3/205 ,  H05K3/44 ,  H05K2201/0379 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/2072 ,  H05K2203/0323

Abstract: A wired circuit board that can provide an enhanced adhesion of a metal supporting board at a marginal portion of an opening formed in the metal supporting board with a simple structure to prevent stripping of the metal supporting board. In a suspension board with circuit, in order to reduce a transmission loss of a conductive pattern, a metal foil embedded in an insulating base layer is formed in a pattern comprising a first metal foil portion and a second metal foil portion surrounding the first metal foil portion spaced apart therefrom, and an opening is formed in the metal supporting board so that a marginal portion of the opening is located in a space between the first metal foil portion and the second metal foil portion.

Abstract translation: 一种布线电路板，其能够以简单的结构提供在金属支撑板上形成的开口的边缘部分处的金属支撑板的增强的附着，以防止金属支撑板的剥离。 在具有电路的悬挂板中，为了减少导电图案的传输损耗，嵌入绝缘基底层中的金属箔以包括第一金属箔部分和围绕第一金属箔的第二金属箔部分的图案形成 部分间隔开，并且在金属支撑板上形成开口，使得开口的边缘部分位于第一金属箔部分和第二金属箔部分之间的空间中。

公开(公告)号：US07336446B2

公开(公告)日：2008-02-26

申请号：US11002199

申请日：2004-12-03

Applicant: Hitoki Kanagawa ,  Yasuhito Funada ,  Tetsuya Oosawa

Inventor： Hitoki Kanagawa ,  Yasuhito Funada ,  Tetsuya Oosawa

IPC: G11B21/16

CPC classification number: G11B5/486 ,  G11B5/484 ,  H05K1/056 ,  H05K3/243 ,  H05K3/28 ,  H05K3/4092 ,  H05K2201/0394 ,  H05K2201/0969

Abstract: A suspension board with circuit having a conductor layer formed in the form of a fine wiring circuit by an additive process, while providing a reduced risk of damage and breaking of the conductor layer in a flying lead portion. The suspension board with circuit comprises a supporting board 2, an insulating base layer 3 formed on the supporting board 2, a conductor layer 4 formed on the insulating base layer 3, an insulating cover layer 5 formed on the conductor layer 4, and a flying lead portion 9 in which a supporting-board-side opening 13, a base-layer-side opening 14, and a cover-layer-side opening 15 are formed so that both sides of the conductor layer 4 can be exposed therefrom. A reinforcing portion 16 or 23 for reinforcing the conductor layer 4 formed continuously from at least either of the insulating base layer 3 and the insulating cover layer 5 along the longitudinal direction of the conductor layer 4 is included in the flying lead portion 9.

Abstract translation: 一种具有电路的悬挂板，其具有通过添加工艺以精细布线电路形式形成的导体层，同时降低了飞行引线部分中的导体层损坏和断裂的风险。 具有电路的悬挂板包括支撑板2，形成在支撑板2上的绝缘基底层3，形成在绝缘基底层3上的导体层4，形成在导体层4上的绝缘覆盖层5， 引导部分9，其中形成有支撑板侧开口13，基底层侧开口14和覆盖层侧开口15，使得导体层4的两侧可以从其露出。 用于加强导体层4的加强部分16或23包括在导线层9的长度方向上，从绝缘基底层3和绝缘覆盖层5中的至少一个连续地形成的导体层4。

公开(公告)号：US07307853B2

公开(公告)日：2007-12-11

申请号：US11342215

申请日：2006-01-30

Applicant: Yasuhito Funada ,  Yoshihiko Takeuchi ,  Hitoki Kanagawa ,  Tetsuya Ohsawa

Inventor： Yasuhito Funada ,  Yoshihiko Takeuchi ,  Hitoki Kanagawa ,  Tetsuya Ohsawa

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K3/0097 ,  H05K1/0393 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/064 ,  H05K2201/0969 ,  H05K2203/0169 ,  H05K2203/0323

Abstract: There is provided a wired circuit board assembly that prevents breakage of the flexing portion of a wired circuit board supported by a support frame. In a wired circuit board support sheet, a plurality of wired circuit boards include a base insulating layer, a conductor pattern, and a cover insulating layer which are formed on a support board are supported by a support frame in such a manner that they are arranged and aligned in mutually spaced relation. Each of the wired circuit boards has a flexing portion formed by removing the support board to obtain a flexing property. In addition, second connecting portions are provided in spanning relation between the flexing portion and the vertical frame parts of the support frame.

Abstract translation: 提供了一种布线电路板组件，其防止由支撑框架支撑的有线电路板的弯曲部分的断裂。 在有线电路板支撑片中，多个布线电路板包括形成在支撑板上的基底绝缘层，导体图案和覆盖绝缘层，由支撑框架支撑，使得它们被布置 并以相互间隔的关系对准。 每个布线电路板具有通过去除支撑板而形成的挠曲部分以获得弯曲性能。 此外，第二连接部分以支撑框架的弯曲部分和垂直框架部分之间的跨度设置。

公开(公告)号：US20070017695A1

公开(公告)日：2007-01-25

申请号：US11477935

申请日：2006-06-30

Applicant: Jun Ishii ,  Yasuhito Ohwaki ,  Yasuhito Funada

Inventor： Jun Ishii ,  Yasuhito Ohwaki ,  Yasuhito Funada

IPC: H05K1/09

CPC classification number: H05K3/38 ,  H05K1/056 ,  H05K3/06 ,  H05K3/205 ,  H05K3/44 ,  H05K2201/0379 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/2072 ,  H05K2203/0323

Abstract: A wired circuit board that can provide an enhanced adhesion of a metal supporting board at a marginal portion of an opening formed in the metal supporting board with a simple structure to prevent stripping of the metal supporting board. In a suspension board with circuit, in order to reduce a transmission loss of a conductive pattern, a metal foil embedded in an insulating base layer is formed in a pattern comprising a first metal foil portion and a second metal foil portion surrounding the first metal foil portion spaced apart therefrom, and an opening is formed in the metal supporting board so that a marginal portion of the opening is located in a space between the first metal foil portion and the second metal foil portion.

Abstract translation: 一种布线电路板，其能够以简单的结构提供在金属支撑板上形成的开口的边缘部分处的金属支撑板的增强的附着，以防止金属支撑板的剥离。 在具有电路的悬挂板中，为了减少导电图案的传输损耗，嵌入绝缘基底层中的金属箔以包括第一金属箔部分和围绕第一金属箔的第二金属箔部分的图案形成 部分间隔开，并且在金属支撑板上形成开口，使得开口的边缘部分位于第一金属箔部分和第二金属箔部分之间的空间中。

公开(公告)号：US20060199402A1

公开(公告)日：2006-09-07

申请号：US11365845

申请日：2006-03-02

Applicant: Jun Ishii ,  Hitoki Kanagawa ,  Yasuhito Funada

Inventor： Jun Ishii ,  Hitoki Kanagawa ,  Yasuhito Funada

IPC: H01R12/00

CPC classification number: H05K1/056 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2203/0723

Abstract: A wired circuit board that can provide a reduced transmission loss and an improved adhesion strength between a metal suspension board and a metal foil with a simple laminar structure, thereby ensuring improved long-term reliability. The wired circuit board 1 comprises a metal suspension board 2, a thin metal film 3 formed on the metal suspension board 2 by sputtering or by electrolytic plating, a metal foil 4 formed on the thin metal film 3 by electrolytic plating, an insulating base layer 5 formed on the metal foil 4 and the metal suspension board 2, and a conductive pattern 6 formed on the insulating base layer 5 as a wired circuit pattern. The wired circuit board 1 may include an insulating cover layer 7 formed on the insulating base layer 5 to cover the conductive pattern 6.

Abstract translation: 一种布线电路板，其能够以简单的层状结构提供降低的传输损耗和改善金属悬挂板和金属箔之间的粘附强度，从而确保改善的长期可靠性。 布线电路板1包括金属悬挂板2，通过溅射或电解电镀形成在金属悬挂板2上的薄金属膜3，通过电解电镀形成在金属薄膜3上的金属箔4，绝缘基底层 形成在金属箔4和金属悬挂板2上的导电图案6和形成在绝缘基底层5上的布线电路图案的导电图案6。 布线电路板1可以包括形成在绝缘基底层5上以覆盖导电图案6的绝缘覆盖层7。

公开(公告)号：US07084493B2

公开(公告)日：2006-08-01

申请号：US11020350

申请日：2004-12-22

Applicant: Yasuhito Funada ,  Tetsuya Ohsawa ,  Yasuhito Ohwaki

Inventor： Yasuhito Funada ,  Tetsuya Ohsawa ,  Yasuhito Ohwaki

IPC: H01L23/14 ,  H01L51/40

CPC classification number: G11B33/122 ,  G11B5/3103 ,  G11B5/3967 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/28 ,  H05K2201/0154 ,  H05K2201/0191

Abstract: In the vicinity of the exposed part 1A of the multiply formed plural wiring conductors 1, of the thicknesses of the insulating cover layer 2 made of a polyimide layer, the thickness (T1) of a part located at about the middle point between the adjacent wiring conductors 1 is made smaller than the thickness (T2) of a part located on wiring conductor 1. Preferably, the difference in the thicknesses of a part located at about the middle point between the adjacent wiring conductors of the insulating cover layer 2 and that of a part located on wiring conductor is made to fall within the range of 1–5 μm. As a result, the insulating cover layer does not peel off easily.

Abstract translation: 在由聚酰亚胺层制成的绝缘覆盖层2的厚度的多重形成的多个布线导体1的露出部分1A的附近，位于中间点之间的部分的厚度（T 1） 使相邻布线导体1小于位于布线导体1上的部分的厚度（T 2）。 优选地，将位于绝缘覆盖层2的相邻布线导体和位于布线导体的部分的相邻布线导体之间的中点附近的部分的厚度差设为在1-5μm的范围内。 结果，绝缘覆盖层不容易剥离。

公开(公告)号：US20060087769A1

公开(公告)日：2006-04-27

申请号：US11256800

申请日：2005-10-24

Applicant: Tetsuya Ohsawa ,  Yasuhito Funada ,  Hitoki Kanagawa

Inventor： Tetsuya Ohsawa ,  Yasuhito Funada ,  Hitoki Kanagawa

IPC: G11B5/60

CPC classification number: G11B5/4853 ,  G11B5/486 ,  H05K1/056 ,  H05K3/3442 ,  H05K3/3494 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2203/041 ,  H05K2203/107 ,  Y02P70/613

Abstract: An area 5 for mounting a magnetic head is formed on a metal board 1, a conductive layer 4 is formed as a circuit pattern via an insulation layer 2 interposed outside this area and up to a metal board 1. A pattern end 4 to be a connection terminal for connection with the terminal of the magnetic head is formed on the circuit pattern, an end face 4a of the pattern end 4 is aligned with an end face 2a of the insulation layer 2 directly beneath it or protruded in the terminating direction from the end face 2a, thereby providing a structure preventing irradiation of a laser beam on the insulation layer 2. Preferably, a stepped-part is formed on the upper surface of the pattern end, two ridge-shaped protrusion parts are formed on a lower level surface on the tip side of the stepped-part, with which the position of a solder ball is stabilized. By this constitution, even when a laser beam is irradiated around the solder ball, it does not easily hit the insulation layer, and dispersion in the solder ball placing positions is minimized.

Abstract translation: 用于安装磁头的区域5形成在金属板1上，导电层4通过设置在该区域外的绝缘层2形成为电路图案，直到金属板1。 在电路图案上形成作为用于与磁头的端子连接的连接端子的图案端4，图案端4的端面4a直接与绝缘层2的端面2a对准 或者从端面2a向终端方向突出，从而提供防止激光束照射在绝缘层2上的结构。 优选地，在图案端的上表面上形成台阶部，在阶梯部的前端侧的下层面上形成两个凸状突起部，焊球位置稳定 。 通过这种结构，即使当激光束照射在焊球周围时，也不容易击中绝缘层，并且使焊球放置位置的分散被最小化。