发明申请
- 专利标题： Room temperature metal direct bonding
- 专利标题（中）： 室温金属直接粘接
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申请号： US11085131申请日： 2005-03-22
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公开(公告)号： US20050161795A1公开(公告)日： 2005-07-28
- 发明人: Qin-Yi Tong , Paul Enquist , Anthony Rose
- 申请人： Qin-Yi Tong , Paul Enquist , Anthony Rose
- 申请人地址： US NC Morrisville
- 专利权人： Ziptronix
- 当前专利权人： Ziptronix
- 当前专利权人地址： US NC Morrisville
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/98 ; H01L23/02
摘要：
A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
公开/授权文献
- US07602070B2 Room temperature metal direct bonding 公开/授权日：2009-10-13
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