发明申请
- 专利标题： Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures
- 专利标题（中）： 多层电路器件和使用电镀牺牲结构的制造方法
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申请号： US11086936申请日： 2005-03-22
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公开(公告)号： US20050161826A1公开(公告)日： 2005-07-28
- 发明人: Rajiv Shah , Shaun Pendo
- 申请人： Rajiv Shah , Shaun Pendo
- 专利权人： MEDTRONIC MINIMED, INC.
- 当前专利权人： MEDTRONIC MINIMED, INC.
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H05K1/16 ; H05K3/04 ; H05K3/40 ; H05K3/46 ; H01L23/053
摘要：
A multilayer circuit includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by electroplating techniques. Substrates formed in this manner enable significant increases in circuit pattern miniaturization, circuit pattern reliability, interconnect density and significant reduction of over-all substrate thickness.
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