发明申请
US20050162603A1 Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film
有权
使用单个各向异性导电膜安装驱动IC芯片和FPC板/ TCP / COF装置的方法
- 专利标题： Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film
- 专利标题（中）： 使用单个各向异性导电膜安装驱动IC芯片和FPC板/ TCP / COF装置的方法
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申请号： US10766536申请日： 2004-01-27
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公开(公告)号： US20050162603A1公开(公告)日： 2005-07-28
- 发明人: Ping-Chin Cheng , Hui-Chang Chen
- 申请人： Ping-Chin Cheng , Hui-Chang Chen
- 主分类号： G02F1/13
- IPC分类号： G02F1/13 ; G02F1/133 ; G02F1/1345 ; G09G3/36 ; H01L21/60 ; H05K3/32 ; H05K3/36
摘要：
A method for bonding integrated circuit chips and other devices to a liquid crystal display panel. The method involves using a single anisotropic conductive film that is sized to bond at least one integrated circuit chip and at least one other device, such as a flexible printed circuit board, a tape carrier package and a chip-on-film, to the liquid crystal display panel.
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