发明申请
- 专利标题: Surface-mount thin-profile capacitor and method of producing the same
- 专利标题(中): 表面贴装薄型电容器及其制造方法
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申请号: US11037509申请日: 2005-01-18
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公开(公告)号: US20050162814A1公开(公告)日: 2005-07-28
- 发明人: Yuichi Maruko , Akihiro Kawai , Toshihisa Nagasawa , Tadamasa Asami
- 申请人: Yuichi Maruko , Akihiro Kawai , Toshihisa Nagasawa , Tadamasa Asami
- 申请人地址: JP Sendai-shi JP Toyama
- 专利权人: NEC TOKIN Corporation,NEC TOKIN Toyama, Ltd.
- 当前专利权人: NEC TOKIN Corporation,NEC TOKIN Toyama, Ltd.
- 当前专利权人地址: JP Sendai-shi JP Toyama
- 优先权: JP18489/2004 20040127
- 主分类号: H01G9/012
- IPC分类号: H01G9/012 ; H01G9/00 ; H01G9/04 ; H01G9/055
摘要:
In a surface-mount thin-profile capacitor including an aluminum foil as a base member composed of an aluminum core and a pair of etched layers covering opposite surfaces of the aluminum core, a resist resin is formed at a boundary between an anode as each of opposite end portions of the aluminum foil and a cathode formed at a center area of each of opposite surfaces of the aluminum foil. The resist resin separates and isolates the etched layer on the side of the anode and a conductive polymer layer from each other. If a part of the conductive polymer layer climbs up onto the resist resin, the climbing part of the conductive polymer layer is covered with an additional resist resin.